Solar Cell Solder Strip Bonding With Reinforced Edge Adhesive Dots
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Solution Overview
Problem
Solar cells without main grid electrodes face issues of loose connections during production, leading to poor reliability and increased rework due to detachment of solder strips from the cell substrate, which affects electrical conductivity and efficiency.
Innovation Solution
A solar cell design incorporating reinforced limiting adhesive dots with enhanced adhesion force at the edges and additional adhesive dots with lower adhesion force, ensuring stable bonding of solder strips to the cell substrate, reducing the risk of detachment and improving structural stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If main grid electrodes are eliminated to reduce material cost, then material cost decreases, but connection reliability deteriorates due to loose connections and solder strip detachment
Solution Approach 1:
The patent applies local quality by creating different adhesive dot types with different adhesion forces at different locations. Reinforced limiting adhesive dots with higher adhesion force are placed at edge regions where solder strips are more prone to detachment, while additional limiting adhesive dots with lower adhesion force are placed in inner regions. This localized differentiation resolves the contradiction by providing enhanced connection reliability specifically where needed without requiring main grid electrodes throughout the entire structure.
2Ease of manufacture
If uniform adhesive dots are used across the cell substrate, then manufacturing simplicity is maintained, but connection reliability deteriorates due to insufficient adhesion at edge regions
Solution Approach 1:
The patent implements local quality by distinguishing between edge regions and inner regions of the cell substrate, applying different adhesive dot configurations to each. The reinforced limiting adhesive dots at edges provide enhanced reliability where detachment occurs most frequently, while the additional limiting adhesive dots in inner regions maintain manufacturing simplicity. This regional differentiation resolves the contradiction between manufacturing ease and connection reliability.
Solution Approach 2:
The patent segments the adhesive dot system into two distinct types: reinforced limiting adhesive dots for edge regions and additional limiting adhesive dots for inner regions. This segmentation allows each type to be optimized for its specific functional requirements, with reinforced dots providing higher adhesion at critical edge locations and additional dots providing sufficient adhesion at less critical inner locations, thereby resolving the contradiction between manufacturing simplicity and connection reliability.
3Reliability
If reinforced adhesive dots are placed at edge regions, then connection reliability improves by preventing solder strip detachment, but device complexity increases due to multiple adhesive dot types and regions
Solution Approach 1:
The patent applies local quality by concentrating reinforced limiting adhesive dots specifically at edge regions where solder strip detachment is most problematic, rather than uniformly across the entire substrate. This targeted approach improves connection reliability at critical locations while minimizing the overall complexity increase, as the additional dot types are only required at specific locations rather than throughout the entire device.
Solution Approach 2:
The patent segments the cell substrate into edge regions and inner regions, with each region receiving appropriately tailored adhesive dot configurations. This segmentation allows the reinforced adhesive dots to be applied only where needed for reliability improvement, rather than increasing complexity across the entire device. The clear regional division makes the complex configuration more manageable and implementable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced adhesion between the solder strips and the cell substrate improves reliability and reduces rework, maintaining electrical conductivity and efficiency by preventing loose connections and shading issues.
Implementation Method 1
The reinforced limiting adhesive dot and the additional limiting adhesive dot are attached to the solder strip and the cell substrate. An adhesion force between the reinforced limiting adhesive dot and the solder strip is greater than that between the additional limiting adhesive dot and the solder strip.
Data Source
AI summary
The present disclosure provides a solar cell, a solar cell string, and a photovoltaic module. The solar cell includes a cell substrate, a solder strip arranged on the cell substrate, and a reinforced limiting adhesive dot and an additional limiting adhesive dot that are attached to the solder strip and the cell substrate. The cell substrate includes an adhesion-enhanced region immediately adjacent to at least one edge of the cell substrate, and an additional region arranged at a side of the adhesion-enhanced region away from the at least one edge. The additional limiting adhesive dot is arranged in the additional region. The reinforced limiting adhesive dot is arranged in the adhesion-enhanced region. An adhesion force between the reinforced limiting adhesive dot and the solder strip is greater than that between the additional limiting adhesive dot and the solder strip.