Solar Cell Back-Surface Electrode Crack Prevention
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Solution Overview
Problem
PERC type solar cell elements face issues with crack formation in the back-surface electrode due to thermal stress caused by differences in thermal expansion coefficients between the protective layer and the metal electrode, leading to increased electrical resistance and reduced power generation efficiency.
Innovation Solution
A solar cell element design featuring a protective layer with a thickness variation region that increases in thickness away from the inner edge of the hole portion, and a back-surface electrode that decreases in thickness, reducing thermal stress and crack formation by gradual heat shrinkage during firing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective layer is formed on the passivation layer to protect the semiconductor substrate, then the reliability of the solar cell element is improved, but thermal stress causes crack formation in the back-surface electrode leading to increased electrical resistance
Solution Approach 1:
The protective layer is designed with spatially varying thickness: a first region with greater thickness located at a distance from the inner edge portion of the hole portion, and a second region with smaller thickness surrounding the first region. This local quality variation reduces thermal stress concentration and prevents crack formation in the back-surface electrode during firing, while maintaining the protective function of the layer.
2Ease of manufacture
If the protective layer has uniform thickness to simplify manufacturing, then the ease of manufacture is improved, but thermal stress concentration occurs leading to crack formation and reduced power generation efficiency
Solution Approach 1:
The thickness parameter of the protective layer is changed spatially to resolve the contradiction. By making the thickness non-uniform (greater in the first region away from the hole portion inner edge, smaller in the surrounding second region), the design prevents thermal stress concentration and crack formation during firing, thereby achieving both manufacturing feasibility and high precision electrode formation without cracks.
3Device complexity
If the back-surface electrode has constant thickness to simplify the structure, then the device complexity is reduced, but thermal expansion differences cause stress concentration and crack formation
Solution Approach 1:
The back-surface electrode is designed with spatially varying thickness: a first region with greater thickness located at a distance from the inner edge portion of the hole portion, and a second region with smaller thickness surrounding the first region. This local quality variation reduces thermal stress concentration and prevents crack formation in the back-surface electrode during firing, while maintaining the protective function of the layer.
4Reliability
If the protective layer thickness increases away from the hole portion inner edge to reduce thermal stress, then crack formation is reduced, but the device complexity increases
Solution Approach 1:
The thickness parameter of the protective layer is changed spatially to resolve the contradiction. By making the thickness non-uniform (greater in the first region away from the hole portion inner edge, smaller in the surrounding second region), the design prevents thermal stress concentration and crack formation during firing, thereby achieving both manufacturing feasibility and high precision electrode formation without cracks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the likelihood of crack formation and improves power generation efficiency by minimizing electrical resistance and maintaining the integrity of the back-surface electrode.
Implementation Method 1
differences in thermal expansion coefficients between the protective layer and the metal electrode, leading to increased electrical resistance and reduced power generation efficiency
Implementation Method 2
thermal stress caused by differences in thermal expansion coefficients between the protective layer and the metal electrode
Data Source
AI summary
The solar cell element includes a semiconductor substrate with first and second surfaces, a passivation layer located on the second surface, a protective layer located on the passivation layer, and a back-surface electrode located on the protective layer. The back-surface electrode is electrically connected to the semiconductor substrate via one or more hole portions penetrating the protective layer and the passivation layer. The protective layer includes a first region showing a tendency to increase in thickness as a distance from an inner edge portion of the hole portion and a second region surrounding the first region. A distance between a position of the first region farthest from the inner edge portion and the inner edge portion is larger than a thickness in the second region. The back-surface electrode shows a tendency to decrease in thickness on the first region as a distance from the inner edge portion.


