Solar Cell Electrode Formation via Metal Layer Heat Treatment
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Solution Overview
Problem
Conventional solar cell electrode formation using paste limits the reduction of electrode width, requires precise alignment, and results in poor contact properties with the dopant layer, leading to reduced productivity and efficiency.
Innovation Solution
A method involving the formation of a metal layer on the dopant layer, followed by heat-treating to create a barrier layer with a compound layer in contact with the semiconductor substrate and a covering metal layer, enhancing electrical properties and reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a paste is used to form an electrode, then the electrode can be formed on the dopant layer, but the electrode width cannot be reduced further and precise alignment is required
Solution Approach 1:
The patent replaces the conventional paste-based electrode formation method with a metal layer deposition method followed by heat treatment. This substitution allows for better control of electrode width and reduced alignment requirements, as the metal layer can be precisely controlled during deposition and the heat treatment process enables proper adhesion without requiring extremely precise alignment between layers.
Solution Approach 2:
The patent changes the physical and chemical parameters of the electrode formation process by using a metal layer that undergoes heat treatment to form a compound layer. This parameter change allows the electrode width to be reduced while maintaining good contact properties, as the heat treatment process enables the metal to react with the dopant layer and form a metallurgical bond that is less sensitive to alignment variations.
2Reliability
If a paste is used to form an electrode, then the electrode can be formed on the dopant layer, but contact property between the electrode and dopant layer is poor
Solution Approach 1:
The patent changes the contact mechanism from physical adhesion of paste to metallurgical bonding through heat treatment. The heat treatment process enables the metal layer to diffuse into the dopant layer and form a compound layer, creating a reliable electrical contact with low contact resistance. This parameter change improves contact property while the overall process remains efficient for mass production.
Solution Approach 2:
The patent creates a composite structure consisting of the metal layer, the compound layer formed by heat treatment, and the dopant layer. This composite structure combines the advantages of each layer: the metal layer provides conductivity, the compound layer provides strong adhesion and low contact resistance, and the dopant layer provides the semiconductor properties. This composite approach improves contact reliability without compromising productivity.
3Loss of energy
If the electrode width is reduced, then shading loss is minimized, but contact resistance increases and alignment becomes more critical
Solution Approach 1:
The patent uses heat treatment to change the physical and chemical parameters of the metal layer, transforming it into a compound layer that has both low contact resistance and good adhesion. This parameter change allows the electrode width to be reduced for minimizing shading loss while maintaining low contact resistance through the metallurgical bonding achieved during heat treatment.
Solution Approach 2:
The patent creates a composite barrier layer structure where the compound layer formed by heat treatment provides excellent electrical contact properties with low contact resistance. This composite structure allows for narrower electrode widths that reduce shading loss while the compound layer ensures reliable electrical contact, effectively decoupling the trade-off between electrode width and contact resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for narrower electrode widths, improved alignment, and increased efficiency by minimizing shading loss and contact resistance, thereby enhancing the productivity and efficiency of solar cell production.
Implementation Method 1
a portion of the metal layer adjacent to the semiconductor substrate forms the first layer including a compound formed by a reaction of the metal layer and the semiconductor substrate
Implementation Method 2
heat-treating the metal layer to form a first layer and a second layer
Data Source
AI summary
A method of manufacturing a solar cell includes: forming a dopant layer by doping a dopant to a semiconductor substrate; and forming an electrode electrically connected to the dopant layer. The forming of the electrode includes forming a metal layer on the dopant layer; and heat-treating the metal layer to form a first layer and a second layer. In the heat-treating of the metal layer, a portion of the metal layer adjacent to the semiconductor substrate forms the first layer including a compound formed by a reaction of the metal layer and the semiconductor substrate, and a remaining portion of the metal layer forms the second layer that covers the first layer.