Solar Cell Electrode Plating With Seed-Layer Perforation
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Solution Overview
Problem
The existing electrode manufacturing method for solar cells faces challenges in achieving an optimal electrode width due to limitations from film perforation by laser, leading to increased laser damage, reduced conversion efficiency, and issues with finger adhesion and line resistance.
Innovation Solution
A method involving film layer perforation in specific regions of the solar cell to form holes or grooves, followed by growing a seed layer that comes into conductive contact through these holes, and then using horizontal electroplating to increase electrode width and reduce line resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the film perforation size by laser is increased to achieve larger electrode width, then the line resistance is reduced, but the laser damage becomes more serious
Solution Approach 1:
The electrode structure is segmented into multiple components: laser-perforated holes for conductive contact, electroplated regions for current collection, and screen-printed paste for connection. This segmentation allows each component to perform its specific function optimally without requiring large laser perforations that cause damage.
Solution Approach 2:
Different regions of the solar cell receive different treatments: some areas have laser perforations, others have electroplating, and some have screen printing. This local differentiation allows the electrode to achieve adequate width and conductivity without excessive laser damage in any single region.
2Length of moving object
If the electrode width is increased to reduce line resistance, then the conversion efficiency is improved, but the sunlight incidence is blocked more
Solution Approach 1:
The electrode structure uses local quality by concentrating conductive materials only where needed (at perforation sites and connection points) rather than creating wide continuous electrodes. This allows adequate electrical conductivity while minimizing the area that blocks sunlight incidence.
Solution Approach 2:
The laser-perforated holes act as intermediaries, providing conductive pathways through the insulating film layer without requiring wide electrodes. This intermediary approach achieves electrical connectivity while maintaining optical transparency.
3Object-affected harmful factors
If the film perforation size by laser is decreased to reduce laser damage, then the electrode width is reduced, but the finger adhesion becomes poor
Solution Approach 1:
The electrode is segmented into multiple small laser-perforated holes rather than one large opening. This segmentation provides numerous attachment points for the finger, improving adhesion reliability while keeping each individual perforation small to minimize laser damage.
Solution Approach 2:
Multiple small perforations are merged with electroplated regions and screen-printed paste to create a composite electrode structure. This combination provides adequate overall electrode width and conductivity while maintaining small perforation sizes that minimize laser damage and improve finger adhesion.
4Ease of manufacture
If the vertical electroplating method is used to manufacture electrodes, then the process is simple, but the electroplating efficiency is low
Solution Approach 1:
The patent inverts the traditional vertical electroplating approach by using horizontal electroplating combined with screen printing. This inversion allows for streamlined processing and higher efficiency while maintaining manufacturing simplicity through the use of standard industrial techniques.
Solution Approach 2:
The electroplating process is made continuous and streamlined by using horizontal electroplating with moving mechanisms that continuously transport substrates through the electroplating bath, eliminating interruptions and maximizing productivity.
5Device complexity
If the vertical electroplating method is used, then the equipment is simple, but the electrode pressure point blocks the electroplating reaction
Solution Approach 1:
The patent inverts the vertical electroplating configuration to horizontal electroplating, which eliminates the electrode pressure point blocking issue. The horizontal arrangement allows electroplating solution to flow freely over the substrate surface without being blocked by pressure points.
Solution Approach 2:
The patent replaces the mechanical vertical pressing system with a horizontal flow-based electroplating system. This substitution eliminates mechanical pressure points that block reactions and allows continuous, uniform electroplating across the substrate surface.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for a significant increase in electrode width, reducing line resistance and preventing finger adhesion issues, while also enabling streamlined electroplating suitable for scale production, thus enhancing the conversion efficiency and reliability of solar cells.
Implementation Method 1
cathode electroplating brush is in contact with the seed layer on the horizontally transmitted solar cell, to form a cathode of an electroplating system on the seed layer
Implementation Method 2
anode terminal is disposed in an electroplating liquid in an electroplating bath
Data Source
AI summary
The disclosure discloses a method for manufacturing a solar cell, a solar module, and a power generation system. The manufacturing method includes the following steps: S1: perforating film layer in a first region and/or a second region of a solar cell where an electrode is to be disposed, thus forming a plurality holes; S2: growing a plurality seed layers on the solar cell, contacting with the first region and/or the second region through the plurality of holes or grooves in S1; and S3: horizontally transporting a to-be-electroplated solar cell on a horizontal electroplating device, to form a cathode on the seed layer, where an anode terminal is disposed in an electroplating liquid in an electroplating bath, and a moving mechanism disposed in the electroplating bath drives the solar cell to move from inlet to outlet, thus achieving electroplating.