Solar Cell Electrode Protrusions for Wiring Delamination
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in solar cell modules is to enhance the bonding strength of wiring material when bonded using a resin adhesive to prevent delamination, which is a common issue with existing resin adhesive bonding methods.
Innovation Solution
The solution involves using protruding portions on the light-receiving surface electrode, which increase the bonding area between the wiring material and the solar cells, specifically designed to enhance the adhesive contact and reduce delamination risks by extending the perimeter of the resin adhesive layer, particularly in the end portions of the solar cell module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If wiring material is bonded to solar cells using a resin adhesive, then the bonding process temperature is reduced, but the bonding strength decreases and delamination occurs
Solution Approach 1:
The invention transitions from bonding only on the flat surface to bonding on both the surface and the side surfaces of the light-receiving surface electrode through protruding portions. This dimensional extension increases the bonding area and prevents delamination while maintaining low-temperature resin adhesive bonding.
Solution Approach 2:
The light-receiving surface electrode is divided into a flat surface portion and multiple protruding portions. This segmentation allows the resin adhesive to bond at multiple locations (surface and sides of protrusions), increasing overall bonding strength while using low-temperature processing.
2Strength
If the bonding area between wiring material and solar cells is increased, then the bonding strength is improved, but the device complexity increases
Solution Approach 1:
Protruding portions are provided only in specific regions where wiring material is bonded, not across the entire electrode surface. This localized approach increases bonding strength at critical points while maintaining simplicity in other areas.
Solution Approach 2:
The protruding portions provide curved side surfaces that increase bonding area compared to a purely flat surface. This geometric modification enhances bonding strength without requiring complex multi-component structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively increases the bonding strength between the wiring material and the solar cells, reliably maintaining electrical connections and suppressing delamination, even in misaligned scenarios, while also simplifying the manufacturing process and reducing costs.
Implementation Method 1
the wiring material and the solar cells be bonded using a resin adhesive
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
The solar cell (10) of the present invention comprises: a first electrode (21) including a plurality of finger portions (21a), and a busbar portion (21b) connected electrically to the plurality of finger portions (21a), each of the plurality of finger portions (21a) extending along a first direction (y), and the plurality of finger portions (21a) being arrayed along a second direction (x) perpendicular to the first direction (y) leaving gaps therebetween; and a plurality of protruding portions (23) provided on at least one side of a first main surface (20A) in the first direction (y) of the busbar portion (21b). The plurality of protruding portions (23) are provided so that the total perimeter of the protruding portions (23) per unit area at the ends of the first main surface (20A) in the second direction (x) is longer than the total perimeter of the protruding portions (23) per unit area in the central portion. By means of these characteristics, the solar cell of the present invention is able to effectively suppress delamination of wiring material (11) by suppressing delamination of the ends, which is where delamination of the wiring material begins when the wiring material (11) is connected to the busbar