Solar Cell Module Encapsulation for Recyclable Disassembly
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Solution Overview
Problem
Conventional silicon crystal solar cell modules are difficult to disassemble for recycling due to the use of thermosetting polymers that form intermolecular cross-linking networks, making it challenging to separate glass and chips without damage.
Innovation Solution
A cell module design with a first protective layer having a cross-linking degree of 0% to 42.3% allows for easy disassembly through thermal or chemical dissociation processes, using a polymer with high-temperature flowability and decomposition temperature higher than the thermosetting resin layer, ensuring minimal fragmentation and maintaining optical, mechanical, and adhesion properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermosetting polymers are used as encapsulating materials to fix solar cell chips, then the reliability and mechanical strength of the module is improved, but the difficulty of disassembly and recycling increases
Solution Approach 1:
The encapsulation system is divided into two distinct layers: a first thermosetting resin layer providing strong adhesion and mechanical support, and a second protective layer with lower cross-linking density that facilitates easy release. This segmentation allows the module to simultaneously achieve high reliability during operation and ease of disassembly for recycling by targeting the second layer for removal while preserving the first layer's structural integrity
Solution Approach 2:
The patent applies parameter changes by controlling the cross-linking degree of the polymer in the second protective layer to be between 0% and 42.3%, which is significantly lower than conventional thermosetting encapsulants. This parameter adjustment transforms the material from a permanently cross-linked state to a partially or minimally cross-linked state, enabling thermal or chemical dissociation for easy removal while the first layer maintains higher cross-linking for structural stability
2Strength
If conventional thermosetting polymers are used for encapsulation, then the mechanical strength and adhesion are improved, but the complexity of recycling process increases
Solution Approach 1:
The second protective layer acts as an intermediary between the solar cell chips and the external environment during recycling. This layer is specifically designed to be removable through thermal or chemical treatment, serving as a sacrificial intermediate that protects the chips during operation but can be easily removed during recycling, thereby simplifying the overall recycling process by providing a clear separation mechanism
Solution Approach 2:
By adjusting the cross-linking degree parameter of the second protective layer to be low (0%-42.3%), the material properties are changed to enable easy thermal or chemical dissociation. This parameter change transforms the recycling process from complex mechanical crushing and high-temperature incineration to a simpler controlled removal process, reducing equipment requirements and process complexity while maintaining adhesion strength during operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables efficient recycling of solar cell modules by allowing easy disassembly with minimal damage, preserving the integrity of components and maintaining high reliability, optical properties, and mechanical strength.
Implementation Method 1
a first protective layer having a cross-linking degree of 0% to 42.3% allows for easy disassembly through thermal or chemical dissociation processes
Implementation Method 2
using a polymer with high-temperature flowability and decomposition temperature higher than the thermosetting resin layer
Data Source
AI summary
A cell module is provided. The cell module includes a first substrate; a second substrate disposed opposite to the first substrate; a cell unit disposed between the first substrate and the second substrate; a first thermosetting resin layer disposed between the cell unit and the first substrate; a first protective layer disposed between the cell unit and the first thermosetting resin layer; and a second thermosetting resin layer disposed between the cell unit and the second substrate. The first protective layer includes a first polymer, wherein the cross-linking degree of the first polymer is 0 to 42.3%.