Thin-Film Solar Cell Partition Groove Formation via Preprocessing

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Solution Overview

Problem

The existing method of mechanical scribing for forming partition grooves in thin-film solar cells faces challenges in controlling pressure, leading to damage of the substrate and residual films, which reduces power generation efficiency.

Innovation Solution

A method that includes forming preprocessing patterns to expose lower layers, allowing the needle to contact and form partition grooves without penetrating through the semiconductor and second electrodes, thereby reducing pressure and preventing residual films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If pressure applied to the scriber needle is increased to ensure it reaches the first electrode, then the needle can penetrate through the second electrode and semiconductor layer, but the substrate may be damaged

Engineering Contradiction:
Improvepartition groove formation accuracyVSAvoidsubstrate damage
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by forming preprocessing patterns (openings) in the second electrode and semiconductor layer before mechanical scribing. These openings expose the first electrode surface in advance, allowing the scriber needle to reach the first electrode without applying excessive pressure that would damage the substrate. The openings are formed at predetermined positions where partition grooves will be created, enabling controlled needle penetration only where needed.

Inventive Principle:
Principle #10Preliminary action

2Object-affected harmful factors

If pressure applied to the scriber needle is decreased to prevent substrate damage, then the needle cannot reach the first electrode, but residual film remains on the first electrode

Engineering Contradiction:
Improvesubstrate damage preventionVSAvoidpartition groove completeness
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The preprocessing patterns are formed in advance to create openings that expose the first electrode surface. This preliminary action ensures that when the scriber needle is applied with controlled pressure, it can directly contact the first electrode through the openings and effectively remove the second electrode and semiconductor layer without leaving residual film, while maintaining safe pressure levels that prevent substrate damage.

Inventive Principle:
Principle #10Preliminary action

3Manufacturing precision

If the scriber needle penetrates through all layers to reach the first electrode, then complete partition grooves are formed, but control of pressure becomes difficult

Engineering Contradiction:
Improvepartition groove depth controlVSAvoidpressure control mechanism
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The preprocessing patterns create openings that expose the first electrode surface before mechanical scribing. This preliminary structuring simplifies pressure control during scribing, as the needle only needs to penetrate through the openings rather than through the entire thickness of the second electrode and semiconductor layer. The openings act as pre-formed channels that guide the needle to the first electrode with minimal pressure variation.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS9735307B2Method of manufacturing thin-film solar cell
Publication Date: 2017.08.15 SOLAR FRONTIER KK
  • US9735307B2 patent drawing
  • US9735307B2 patent drawing
  • US9735307B2 patent drawing

AI summary

A method of manufacturing a thin-film solar cell includes forming a first electrode on a substrate; forming a first petition groove for dividing the first electrode; forming a semiconductor layer on the first electrode and in the first partition groove; forming a second partition groove for dividing the semiconductor layer; forming a second electrode on the semiconductor layer and in the second partition groove; and forming a third partition groove for dividing the second electrode and the semiconductor layer. At least one of the steps of forming the first partition groove, the second partition groove, and the third partition groove includes forming an opening in a partition groove forming layer to expose a lower layer surface below the partition groove forming layer, bringing a needle into contact with the lower layer surface, and forming the partition groove by moving the needle in a predetermined direction.