Solar Cell Integrated IC Package for Self-Powered Embedded Systems
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional integrated circuit (IC) chips in small form factors, such as those used in mobile devices, rely on external power sources, making it difficult to embed them in items like clothing, shoes, or the human body due to the need for external power access.
Innovation Solution
Incorporating an integral solar cell within the IC package, which converts light into electrical power, reducing or eliminating the need for an external power source by using a lead frame with a solar cell attached to the IC chip and encapsulated with a mold compound to ensure efficient energy harvesting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an external power source is used to power the IC chip, then the IC chip can be adequately powered, but the IC chip requires external power access which makes embedding in items like clothes, shoes, or the human body very difficult
Solution Approach 1:
The patent combines the solar cell directly with the IC chip package, integrating the power generation function into the chip itself. The solar cell is mounted on the lead frame and electrically connected to the IC chip, creating a self-contained powered device that eliminates the need for separate external power sources and complex power connection requirements.
2Adaptability or versatility
If a solar cell is integrated into the IC package to eliminate external power sources, then embedding flexibility is improved, but the device structure becomes more complex
Solution Approach 1:
The lead frame serves multiple functions: it provides electrical connections for the IC chip, supports the solar cell mounting, and acts as the structural base for the entire package. This multi-functionality reduces the need for additional components and simplifies the overall device structure despite the added solar cell integration.
Solution Approach 2:
The solar cell is mounted on the lead frame in a nested arrangement where the solar cell, IC chip, and lead frame are integrated in a compact configuration. The mold compound encapsulates both the IC chip and solar cell together, creating a compact nested structure that minimizes overall device size and complexity.
3Use of energy by moving object
If the solar cell size is reduced to match the IC chip size for low power environments, then power requirements are met, but the light-receiving surface area is reduced
Solution Approach 1:
The patent applies different properties to different parts of the package: the solar cell is positioned on the lead frame with its light-receiving surface oriented to maximize exposure to incident light, while the IC chip is positioned on the opposite side. This spatial arrangement optimizes the solar cell's light-receiving capability within the constrained size of the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated solar cell package provides sufficient power to the IC chip, minimizing the need for external power connections, enabling more flexible and embedded applications.
Implementation Method 1
A solar cell has opposing first and second main surfaces, where at least a portion of the first main surface is configured to receive light from an external source and the second main surface of the solar cell is attached to the chip support area of the first main surface of the lead frame. The solar cell converts energy of the received light into electrical power.
Data Source
AI summary
A self-powered integrated circuit (IC) device includes a lead frame and a solar cell having first and second main surfaces. The solar cell is mounted on a surface of the lead frame. An IC chip is also provided. A first electrical interconnector electrically couples the IC chip to the lead frame and a second electrical interconnector electrically couples the solar cell to the IC chip. A portion of the first main surface of the solar cell is configured to receive light from an external source. The solar cell converts energy of the received light into electrical power that is supplied to the IC chip. A mold compound encapsulates the IC chip, the first and second electrical interconnectors, and at least a portion of the solar cell.