Solar Cell Lead Wire Flat Solder Layer Manufacturing
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Solution Overview
Problem
Conventional solar cell lead wires with bulged molten solder plated layers face issues with stable lamination, deformation, tangling, and increased risk of cell cracks due to uneven thickness and small contact area, leading to misalignment and heat conduction defects during soldering.
Innovation Solution
A solar cell lead wire with a flat solder plated layer formed on both surfaces of a conductive material, using a method that involves rolling the plated wire after cooling to ensure uniform thickness and reduce processing strain, thereby stabilizing the position and improving heat conduction during soldering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the molten solder plated layer is formed in a mountain-like shape by surface tension during solidification, then the spread of solder on the upper and lower surfaces is increased and joint force is strengthened, but the laminated state becomes unstable and deformation of winding is likely to occur
Solution Approach 1:
The invention changes the shape parameter of the solder plated layer from a mountain-like shape to a flat shape by controlling the solidification process. This is achieved by forming the solder plated layer on a ribbon-shaped conductive material in a controlled manner to prevent surface tension from creating a mountain-like shape, thereby ensuring stable lamination during winding while maintaining sufficient joint force through adequate solder spread.
2Quantity of substance
If the molten solder plated layer is formed in a mountain-like shape, then solder spread is increased, but the contact area with the air suction jig becomes small and suction force is insufficient
Solution Approach 1:
The invention changes the surface topology parameter of the solder plated layer from a mountain-like shape with small contact areas to a flat shape with large contact areas. This ensures that the air suction jig can effectively contact the solder plated layer on the upper and lower surfaces, providing sufficient suction force for handling the solar cell lead wire during the suction and movement process.
3Strength
If the molten solder plated layer has uneven thickness, then joint force may be strengthened in some areas, but misalignment occurs during soldering and cell cracks are generated
Solution Approach 1:
The invention changes the thickness distribution parameter of the solder plated layer from uneven thickness to uniform thickness by controlling the plating process. This ensures that the solder plated layer has consistent thickness across the upper and lower surfaces, preventing misalignment during soldering and reducing the risk of cell cracks while maintaining adequate joint force through uniform solder distribution.
4Temperature
If the contact area of the front surface electrode with the molten solder plated layer is small, then heat conduction from the semiconductor substrate to the solder plated layer is not sufficient, but increasing contact area may affect other parameters
Solution Approach 1:
The invention changes the surface geometry parameter of the solder plated layer from a mountain-like shape to a flat shape, which increases the contact area between the solder plated layer and the front surface electrode. This improved contact area ensures sufficient heat conduction from the semiconductor substrate to the solder plated layer during soldering, eliminating heat conduction defects without requiring additional structural modifications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flat solder plated layer enhances the stability of the solar cell lead wires during winding, reduces the risk of deformation and tangling, and prevents cell cracks by ensuring a strong, uniform joint with the semiconductor substrate, improving the overall yield and reliability of solar cell assembly.
Implementation Method 1
a solder plated layer on a periphery of the conductive material... soaking the conductive material in a molten solder in a molten solder plating bath
Implementation Method 2
cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material
Implementation Method 3
the plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling
Data Source
AI summary
A solar cell lead wire includes a conductive material, and a solder plated layer on a periphery of the conductive material. The solder plated layer is formed flat by rolling. A method of manufacturing a solar cell lead wire includes feeding an elongate conductive material from a feed reel, the elongate conductive material including a rectangular conductor or a round conductor, soaking the conductive material in a molten solder in a molten solder plating bath, cooling the conductive material to have a plated wire with a solder plated layer formed on the conductive material, and winding the plated wire on a winding reel. The plated wire is formed flat by rolling after the solder plated layer of the plated wire is solidified by the cooling.