Solar Cell Module Molded Lead-Frame Manufacturing
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Solution Overview
Problem
Conventional solar cell modules face high manufacturing costs and low utilization due to the use of ceramic substrates and individual unit production, with quality issues related to thermal bonding and void control, making them inefficient and costly.
Innovation Solution
The use of a copper lead-frame substrate with soft solder techniques for component attachment, replacing thermal heating, and adopting a strip format production approach to enhance thermal conductivity and control voids between the thermal pad and die.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional ceramic substrates and thermal bonding techniques are used, then manufacturing processes are established, but manufacturing costs are high and quality control is difficult
Solution Approach 1:
The patent changes the bonding mechanism from thermal bonding to mechanical interlocking through undercuts. The mold cavity includes undercut features that mechanically lock the solar cell to the substrate, eliminating the need for thermal bonding processes. This parameter change from thermal to mechanical bonding reduces manufacturing complexity and improves quality control while maintaining reliability.
Solution Approach 2:
The patent extracts the thermal bonding step from the manufacturing process entirely. By using mechanical interlocking through undercuts, the complex thermal bonding equipment and processes are removed, simplifying the manufacturing line and reducing costs while improving quality consistency.
2Productivity
If individual unit production is used, then each solar cell can be manufactured separately, but production efficiency is low and costs increase
Solution Approach 1:
The patent segments the mold into multiple cavities, allowing simultaneous production of multiple solar cells in one molding cycle. The mold can produce arrays of solar cells that are then separated, dramatically increasing production efficiency compared to individual unit production while maintaining manufacturing simplicity.
Solution Approach 2:
The patent combines multiple solar cell production operations into a single molding process. By producing multiple cells simultaneously in one mold, the patent merges what would otherwise be separate manufacturing steps, improving productivity and reducing per-unit costs.
3Manufacturing precision
If thermal heating is used for bonding, then components can be attached, but void control between die and thermal pad becomes inconsistent
Solution Approach 1:
The patent replaces the thermal bonding system with a mechanical interlocking system. Instead of using heat and pressure to bond components, the mold cavity uses undercut features that physically lock the solar cell to the substrate. This mechanical approach provides consistent void control without the complexity of thermal processing equipment and parameters.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a solar cell module with increased capability, quality, and reduced costs, offering improved thermal conductivity and easier manufacturing processes.
Implementation Method 1
A solder material is disposed between and adheres the upper surface of the substrate and the lower surface of the semiconductor die
Implementation Method 2
copper lead-frame provides a higher thermal conductivity than conventional ceramic substrates
Data Source
AI summary
A solar cell having a molded lead frame, and method of manufacture of same, is disclosed. Specifically, a plurality of solar cells is manufactured from a strip of lead-frames and soft solder techniques for die assembly and component assembly. After wire bonding, glass attachment and transfer molding, a trim and form process produces individual solar cells having a molded lead frame.