Solar Cell Module Non-Contiguous Resin Adhesive Thermal Stress

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Solution Overview

Problem

Solar cell modules face durability challenges due to repeated temperature changes, which can cause damage or deformation during the bonding process with traditional soldering methods, and existing adhesive solutions do not adequately address the issue of thermal stress between solar cells and wiring materials.

Innovation Solution

A solar cell module is manufactured using a resin adhesive that forms a non-contiguous region between the solar cell and wiring material, mitigating thermal stress through a partial bonding approach, where the resin adhesive is applied in a way that creates a specific ratio of non-adhered area to adhered area, enhancing durability against temperature fluctuations.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If solder is used for bonding the solar cell and wiring material, then strong adhesion is achieved, but the solar cell becomes hot and may be damaged or deformed

Engineering Contradiction:
Improveadhesion strengthVSAvoidthermal damage
Core Design Contradiction:
StrengthVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the thermal bonding process (soldering) with a mechanical bonding process using resin adhesive. The resin adhesive bonds the wiring material to the solar cell at low temperatures without melting, thereby eliminating thermal damage while maintaining adhesion strength through the resin's bonding properties

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the bonding temperature parameter from high (soldering requires melting temperature) to low (resin adhesive bonding at room or elevated but controlled temperatures). This parameter change eliminates thermal damage to the solar cell while maintaining effective adhesion through the resin material

Inventive Principle:
Principle #35Parameter changes

2Object-affected harmful factors

If resin adhesive is used for bonding, then thermal damage is prevented, but durability against repeated temperature changes deteriorates

Engineering Contradiction:
Improvethermal damageVSAvoiddurability against temperature changes
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The patent segments the bonding interface by creating a non-contiguous resin adhesive layer with alternating bonded and non-bonded regions. This segmentation allows different portions of the bonding interface to respond differently to thermal expansion, with non-bonded regions acting as stress relief zones that accommodate dimensional changes during temperature cycling

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by creating regions of different bonding characteristics within the same bonding interface. The non-contiguous resin adhesive layer provides localized stress relief in non-bonded regions while maintaining strong adhesion in bonded regions, optimizing both thermal damage prevention and durability against temperature changes

Inventive Principle:
Principle #3Local quality

3Strength

If full bonding is applied, then bond strength is maximized, but thermal stress from expansion differences causes separation

Engineering Contradiction:
Improvebond strengthVSAvoidresistance to separation
Core Design Contradiction:
StrengthVSReliability

Solution Approach 1:

The patent segments the bonding interface into bonded and non-bonded regions. The non-contiguous resin adhesive layer creates a pattern where strong adhesion in bonded regions provides bond strength while non-bonded regions serve as expansion joints that accommodate thermal expansion differences, preventing stress concentration and separation

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies partial bonding rather than full bonding. By using a non-contiguous resin adhesive layer, the patent achieves sufficient bond strength in the bonded regions while intentionally leaving non-bonded regions to provide stress relief, demonstrating that complete bonding is not necessary for optimal performance

Inventive Principle:
Principle #16Partial or excessive action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The partial bonding method improves the durability of solar cell modules by reducing the risk of separation between the solar cell and wiring material due to thermal expansion differences, maintaining bond strength while allowing for effective thermal stress mitigation.

Implementation Method 1

the adhesion between the solar cell and the wiring material using a conductive resin adhesive has been studied in recent years

Methodology Applied
Scientific EffectAdhesion: Adhesive

Implementation Method 2

the durability against repeated changes in temperature is further improved in a solar cell module including a solar cell and a wiring material bonded with a resin adhesive

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentEP2590228B1Solar cell module and method for manufacturing same
Publication Date: 2021.02.17 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • EP2590228B1 patent drawingFigure 1
  • EP2590228B1 patent drawingFigure 2
  • EP2590228B1 patent drawingFigure 3

AI summary

[Problem] To provide a solar cell module formed by adhering solar cells and a wiring member together using a resin adhesive, in which a durability against repeated temperature changes is further improved. [Solving Means] A solar cell module (1) is provided with: a plurality of solar cells (10) including a photoelectric conversion unit (20), and an electrode (21) which is formed on the surface of the photoelectric conversion unit (20); a wiring member (11) that electrically connects the plurality of solar cells (10); and a resin adhesive (12) that adheres the solar cells (10) and the wiring member (11). Non-contiguous regions of the resin adhesive (12) are present between the wiring member (11) and the solar cells (10).