Solar Cell Module Resin Adhesive Segmentation for Thermal Stress
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing bonding techniques for solar cell modules using resin adhesives between wiring members and connection electrodes result in significant stress due to thermal expansion and contraction, leading to microscopic exfoliation and cracking over time.
Innovation Solution
A solar cell module design featuring removed portions in the resin adhesive, aligned vertically to the principal surface, with convex parts on the connection electrodes contacting the wiring members, reduces stress by microscopically sectioning the adhesive and ensuring direct electrical contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If resin adhesive is used to bond wiring members to connection electrodes, then the influence of temperature change on solar cells is reduced compared to soldering, but stress remains inside the resin adhesive due to thermal expansion and contraction
Solution Approach 1:
The resin adhesive is divided into multiple regions by forming removed portions (through-holes) that extend from the front surface to the back surface. This segmentation allows the adhesive to expand and contract independently in different regions, reducing internal stress caused by thermal expansion and contraction while maintaining the bonding function.
2Reliability
If the resin adhesive is bonded to the wiring member and connection electrode, then electrical connection is achieved, but microscopic exfoliation and cracking occur over time due to remaining stress
Solution Approach 1:
By segmenting the resin adhesive through removed portions, the patent prevents the continuous stress accumulation that leads to exfoliation and cracking. The segmented structure allows stress relief while maintaining electrical contact through the wiring member that spans across the removed portions.
Solution Approach 2:
The patent extracts (removes) portions of the resin adhesive to create through-holes. This extraction reduces the total volume of adhesive that generates stress, while the remaining adhesive portions maintain sufficient bonding strength and electrical connectivity.
3Reliability
If convex parts are formed on the connection electrode to contact the wiring member, then direct electrical contact is ensured, but the manufacturing process becomes more complex
Solution Approach 1:
The patent merges the formation of convex parts with the screen printing process used for applying the resin adhesive. The convex parts are created as part of the same manufacturing step, eliminating the need for separate machining or forming operations and reducing overall process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration minimizes stress in the resin adhesive, preventing microscopic exfoliation and cracking, while maintaining electrical connectivity and productivity through the use of screen-printed convex parts.
Implementation Method 1
the resin adhesives expand as the temperature increases
Implementation Method 2
then contracts as curing progresses
Data Source
AI summary
In the solar cell module 100, the resin adhesive 12 includes a plurality of removed portions 12a on the principal surface of the photoelectric conversion part 20 by removing the resin adhesive 12 in a vertical direction. The plurality of removed portions 12a are formed in the row in cross directions K.