Thin-Layer Solar Cell Serial Connection via Segmented Surface Treatment

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Solution Overview

Problem

Existing methods for serial connection of thin-layer solar cells require multiple surface-treatment steps, leading to interruptions in deposition processes, high costs, and a risk of short circuits due to differing layer adhesion and conductivity issues, resulting in inefficient power generation and wasted active solar cell surfaces.

Innovation Solution

The surface treatment process is modified to penetrate all layers above the metallic back contact layer, allowing for identical parameters and technologies to be used for steps A and B, and filling trenches A and C with insulating paste before step A, minimizing inactive surface area and avoiding short circuits by ensuring precise application of conducting paste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple surface-treatment steps are performed to achieve serial connection, then connection reliability is improved, but deposition process continuity deteriorates and manufacturing complexity increases

Engineering Contradiction:
Improveconnection reliabilityVSAvoiddeposition process continuity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent applies preliminary action by performing surface treatment steps A and B before the deposition process is complete. By preparing the surfaces in advance with different treatment depths (step A to buffer layer, step B to back contact layer), the subsequent connection process becomes simpler and more reliable, while maintaining overall process efficiency.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent segments the surface treatment into distinct steps with different depths: surface treatment A removes layers down to the buffer layer, while surface treatment B removes layers down to the back contact layer. This segmentation allows each step to be optimized independently, improving connection reliability without requiring complete interruption of deposition.

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If multiple surface-treatment steps with differing depths are performed, then connection precision is improved, but process complexity and cost increase

Engineering Contradiction:
Improveconnection precisionVSAvoidprocess complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent divides surface treatment into segmented steps (A and B) with specific depth requirements. Step A treats to the buffer layer level, while step B treats to the back contact layer level. This segmentation achieves precise connection control without requiring three separate treatment steps, thereby reducing process complexity while maintaining manufacturing precision.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent makes surface treatment steps A and B universally applicable by using identical parameters and technologies for both steps. This multi-functionality approach allows the same equipment and parameter sets to be used for different treatment depths, reducing the need for additional technologies and simplifying the overall process.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Area of stationary object

If surface treatment penetrates all layers above back contact, then inactive surface area is minimized, but risk of short circuit increases

Engineering Contradiction:
Improveinactive surface areaVSAvoidshort circuit risk
Core Design Contradiction:
Area of stationary objectVSReliability

Solution Approach 1:

The patent applies local quality by differentiating the penetration depth of surface treatment steps: step A penetrates to the buffer layer while step B penetrates to the back contact layer. This localized differentiation minimizes inactive surface area in critical regions while maintaining adequate insulation in other regions, thereby reducing short circuit risk without sacrificing active area.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent performs preliminary surface treatment to create distinct depth levels before filling with conductive paste. By预先 establishing the proper surface topology with treatments A and B, the subsequent paste application can be precisely controlled to make electrical contact only where needed, minimizing inactive area while preventing short circuits through proper insulation positioning.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS8778723B2Serial connection of thin-layer solar cells
Publication Date: 2014.07.15 OC3 AG
  • US8778723B2 patent drawing
  • US8778723B2 patent drawing
  • US8778723B2 patent drawing

AI summary

The invention relates to a serial connection of thin layer solar cells. The invention provides a structuring method for creating a reliable and effective connections, preventing short-circuits and enlarging usable solar cell surfaces. The solar cells comprise a substrate, a back contact layer, an absorber layer, a buffer layer, and a transparent front contact layer. Each solar cell is subdivided by three trenches A, B, C to create a plurality of adjacent cell segments. Trenches A and B extend down to the back contact layer, trench C extends down to the substrate. Trench C is filled with electrically insulating paste and trench B is filled with electrically conducting paste. The electrically conducting paste also covers trench C. The adjacent cell segments are electrically connected. Trench A is then created and filled with electrically insulating paste.