Solar Cell Surface Structure to Reduce Reflection Without Polishing

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Solution Overview

Problem

Existing solar cell manufacturing processes face challenges in achieving high efficiency and reliability due to issues related to mirror-polishing and reflection at the surface of semiconductor substrates, which affect the interface properties and overall performance of solar cells.

Innovation Solution

A solar cell design featuring a semiconductor substrate with a rounded uneven member at one surface and a different uneven portion at the opposite surface, eliminating the need for mirror-polishing while reducing reflectance and enhancing interface properties, thereby improving efficiency and reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If mirror-polishing process is performed on the semiconductor substrate surface, then surface smoothness is improved, but reflection is increased and interface properties are deteriorated

Engineering Contradiction:
Improvesurface smoothnessVSAvoidreflection
Core Design Contradiction:
ShapeVSObject-generated harmful factors

Solution Approach 1:

The patent applies curvature principle by forming rounded uneven members with curved surfaces instead of flat surfaces on the semiconductor substrate. The rounded shape with curvature radius R1-R5 reduces light reflection compared to flat mirror-polished surfaces, while the curved geometry maintains surface smoothness. This directly resolves the contradiction by using curved surfaces that inherently reduce reflection while preserving smoothness.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The patent applies local quality principle by creating localized rounded uneven members at specific positions on the semiconductor substrate surface rather than uniform treatment. Each rounded uneven member has locally optimized curvature radius (R1-R5) to control reflection at that specific location while maintaining overall surface quality. This allows different regions to have different properties optimized for their specific functions.

Inventive Principle:
Principle #3Local quality

2Shape

If mirror-polishing process is performed on the semiconductor substrate surface, then surface smoothness is improved, but interface properties are deteriorated

Engineering Contradiction:
Improvesurface smoothnessVSAvoidinterface properties
Core Design Contradiction:
ShapeVSReliability

Solution Approach 1:

The rounded uneven members with curved surfaces improve interface properties by reducing stress concentration that occurs at sharp edges of flat surfaces. The curvature distributes mechanical and thermal stresses more evenly across the interface between semiconductor substrate and adjacent layers, enhancing reliability while maintaining surface smoothness through controlled rounding.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The rounded uneven members act as cushioning elements that preemptively absorb and distribute mechanical and thermal stresses before they can cause interface failure. The curved geometry provides a buffer zone that protects the interface between semiconductor substrate and adjacent layers from stress concentration, thereby preventing reliability issues before they occur.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

3Ease of manufacture

If conventional manufacturing process is used, then manufacturing simplicity is maintained, but productivity and reliability are insufficient

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidmanufacturing efficiency
Core Design Contradiction:
Ease of manufactureVSProductivity

Solution Approach 1:

The rounded uneven members are formed as preliminary structures on the semiconductor substrate before subsequent manufacturing steps. This preliminary action of creating the rounded geometry early in the process enables improved light reflection control and interface properties to be built into the device architecture from the start, rather than requiring complex post-processing steps, thereby enhancing productivity.

Inventive Principle:
Principle #10Preliminary action

4Ease of manufacture

If conventional manufacturing process is used, then manufacturing simplicity is maintained, but efficiency is insufficient

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidlight reflection loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

The rounded uneven members with curved surfaces reduce light reflection loss by scattering incident light more effectively than flat surfaces. The curvature causes light to reflect at multiple angles rather than being reflected uniformly, increasing light absorption in the solar cell. This reduces energy loss from reflection while the structure can be integrated into conventional manufacturing processes.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed design enhances the efficiency and reliability of solar cells by minimizing reflection and preventing issues associated with mirror-polishing, allowing for high productivity in manufacturing solar cells with improved performance.

Implementation Method 1

reflectance at the one surface can be reduced

Methodology Applied
Scientific EffectLight scattering: Scattering

Implementation Method 2

reflection at the other surface can be minimized

Methodology Applied
Scientific EffectLight reflection minimization: Reflection

Data Source

PatentUS11855234B2Solar cell and method of manufacturing the same
Publication Date: 2023.12.26 JINKOSOLAR MIDDLE EAST FZCO
  • US11855234B2 patent drawing
  • US11855234B2 patent drawing
  • US11855234B2 patent drawing

AI summary

A method of manufacturing a solar cell, includes forming a rounded uneven member having a rounded end portion at a second surface of a semiconductor substrate having a first surface and the second surface opposite to each other, forming conductive regions comprising forming a first conductive region at the first surface of the semiconductor substrate and forming a second conductive region on the second surface of the semiconductor substrate, wherein the second conductive region comprises a semiconductor layer different and separated from the semiconductor substrate and forming electrodes comprising forming a first electrode electrically connected to the first conductive region and forming a second electrode electrically connected to the second conductive region.