Solar Cell Interconnection via Conductive Vias on Common Back Plane

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Solution Overview

Problem

High-volume manufacturing of III-V compound semiconductor multijunction solar cells for space and terrestrial applications faces challenges due to high cost, poor wafer utilization, material defects, fragility, and complexity in interconnecting large numbers of small solar cells, which increases manufacturing costs and reduces reliability.

Innovation Solution

A solar cell assembly comprising a support with conductive layers and vias for efficient electrical connection of small solar cells, allowing for parallel or series connections, and a flexible substrate for improved packing density and reduced waste, utilizing a polyimide material for flexibility and automated manufacturing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If a large number of small solar cells are used to reduce material waste, then wafer utilization is improved, but manufacturing complexity and interconnection requirements increase

Engineering Contradiction:
Improvematerial wasteVSAvoidinterconnection complexity
Core Design Contradiction:
Loss of substanceVSDevice complexity

Solution Approach 1:

Multiple small solar cells are mounted on a single common back plane and electrically interconnected through conductive layers and vias, merging them into a functional module. This approach utilizes the full circular wafer area by dividing it into many small cells while providing a unified electrical interface, thereby reducing material waste without proportionally increasing interconnection complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common back plane serves multiple functions simultaneously: it provides mechanical support for mounting multiple solar cells, establishes electrical interconnections through integrated conductive layers and vias, and creates a unified electrical interface for the entire module. This multi-functionality reduces the need for separate interconnection components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Loss of substance

If many small solar cells are interconnected to utilize full wafer area, then wafer utilization is improved, but manufacturing cost increases

Engineering Contradiction:
Improvematerial wasteVSAvoidmanufacturing cost
Core Design Contradiction:
Loss of substanceVSEase of manufacture

Solution Approach 1:

Multiple small solar cells are mounted on a single common back plane and electrically interconnected through conductive layers and vias, merging them into a functional module. This approach utilizes the full circular wafer area by dividing it into many small cells while providing a unified electrical interface, thereby reducing material waste without proportionally increasing interconnection complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The conductive layers and vias are integrated into the back plane structure itself, allowing the back plane to automatically provide both mechanical support and electrical interconnection functions. This self-service approach eliminates the need for separate, additional interconnection components, thereby reducing manufacturing cost.

Inventive Principle:
Principle #25Self-service

3Loss of substance

If many small solar cells are used to reduce waste, then material utilization is improved, but reliability decreases due to increased interconnection points

Engineering Contradiction:
Improvematerial wasteVSAvoidinterconnection reliability
Core Design Contradiction:
Loss of substanceVSReliability

Solution Approach 1:

Multiple small solar cells are mounted on a single common back plane and electrically interconnected through conductive layers and vias, merging them into a functional module. This approach utilizes the full circular wafer area by dividing it into many small cells while providing a unified electrical interface, thereby reducing material waste without proportionally increasing interconnection complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The common back plane with its integrated conductive layers and vias acts as an intermediary structure that provides robust electrical interconnection between multiple small solar cells. This intermediary approach creates reliable electrical pathways while maintaining mechanical stability, thereby improving overall module reliability despite the increased number of interconnection points.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enables a lightweight, high-efficiency solar cell assembly with improved power-to-weight and power-to-area ratios, reduced material waste, and enhanced reliability through efficient interconnection of small solar cells, suitable for space applications and flexible panel configurations.

Implementation Method 1

Solar power from photovoltaic cells, also called solar cells

Methodology Applied
Scientific EffectPhotovoltaic effect: Photovoltaic Effect

Data Source

PatentEP3848979A1Solar cell module with interconnection of neighboring solar cells on a common back plane
Publication Date: 2021.07.14 SOLAERO TECHNOLOGIES CORP
  • EP3848979A1 patent drawingFigure 1A~1B
  • EP3848979A1 patent drawingFigure 1C
  • EP3848979A1 patent drawingFigure 1D~1E

AI summary

A solar cell assembly or module comprising a plurality of solar cells mounted on a support, the support comprising a plurality of conductive vias extending from the top surface to the rear surface of the support. Each one of the plurality of solar cells is placed on the top surface with the first contact of a first polarity of the solar cell electrically connected to the first conductive via. A second contact of a second polarity of each solar cell can be connected to a second conductive via so that the first and second conductive portions form terminals of opposite conductivity type. The solar cells on the module can be interconnected to form a string or an electrical series and/or parallel connection by suitably interconnecting the terminal pads of the vias on the back side of the module.