Back-Contact Solar Cell Wire Metallization Without Busbars

The patent removes busbars from the solar cell structure entirely, extracting the problematic component that caused both efficiency loss and manufacturing complexity. Instead of using traditional busbar metallization, the patent employs wire-based connections that eliminate the need for large-scale metal deposition and patterning processes, thereby reducing manufacturing cost while maintaining or improving efficiency.

The patent replaces the mechanical busbar structure with a wire-based system that uses compression bonding and ultrasonic welding. This substitution eliminates the need for complex photolithography and metal deposition processes required for busbars, simplifying manufacturing while reducing material usage and improving electrical efficiency through direct wire-to-contact-point connections.

The patent incorporates alignment features directly into the mold during the injection molding process. These features, such as recesses and protrusions, are pre-formed to guide wire placement and ensure precise alignment with contact points before bonding occurs. This preliminary structuring eliminates the need for complex post-molding alignment procedures and reduces bonding difficulty.

The patent introduces alignment features as intermediary structures that mediate between the wire and the contact points. These features, integrated into the mold structure, serve as physical guides that automatically position wires correctly during the bonding process, thereby simplifying alignment operations and ensuring manufacturing precision without requiring high-precision manual or automated positioning systems.

The patent segments the continuous wire into discrete sections by cutting it between adjacent solar cells. This segmentation creates individual wire segments that can be independently managed and bonded to each cell's contact points. The cut ends are then insulated or protected to prevent electrical shorts while maintaining mechanical flexibility for strain relief.

The patent incorporates strain relief features directly into the mold structure before wire bonding occurs. These features, such as flexible loops or buffered sections, are pre-formed to absorb thermal expansion and mechanical stress. By providing this cushioning in advance, the patent protects the wire bonds from strain-induced failures during subsequent processing and operation without adding complexity to the metallization process.