Solar Interconnector Flux Coating via Submerged Dipping
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Solution Overview
Problem
Existing flux coating processes for solar cell panels often result in undesirable damage to interconnectors and inadequate or uneven flux application, which can compromise the adhesion properties between interconnectors and solar cells.
Innovation Solution
A flux coating device and method that utilizes a flux bath with an inlet and outlet configuration allowing interconnectors to pass below the flux surface without route changes, enabling a dipping process for uniform flux application, particularly effective for interconnectors with rounded or circular cross-sections, ensuring a sufficient flux thickness and improved adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional flux coating process is used, then the flux can be applied to the interconnector, but the flux coating is uneven and insufficient, and damage occurs to the interconnector
Solution Approach 1:
Instead of passing the interconnector over the flux bath surface, the patent inverts the approach by passing the interconnector below the flux surface through the flux bath. This inversion allows the flux to uniformly coat the entire surface of the interconnector including rounded portions, while the gentle dipping action prevents damage to the interconnector.
Solution Approach 2:
The patent changes the key parameter of flux application by submerging the interconnector below the flux surface rather than applying flux from above. This parameter change enables the flux to uniformly penetrate and coat all surfaces of the interconnector, achieving sufficient and even coverage without concentrated force that could cause damage.
2Manufacturing precision
If the interconnector passes through the flux bath with route changes, then the flux can be applied, but the flux coating becomes insufficient on certain surfaces
Solution Approach 1:
The patent inverts the conventional coating approach by passing the interconnector below the flux surface rather than over it. This simple inverted path ensures the flux contacts all surfaces of the interconnector uniformly, achieving sufficient coating thickness without requiring complex routing or multiple application stages.
3Strength
If the flux is applied to improve adhesion, then the bonding between interconnector and solar cell improves, but the interconnector may be damaged in the process
Solution Approach 1:
By inverting the flux application method to pass the interconnector below the flux surface, the patent achieves comprehensive flux coverage that improves adhesion strength. The gentle submerged passage prevents mechanical damage that could occur with conventional overhead application methods.
Solution Approach 2:
The patent changes the application method parameter from overhead coating to submerged dipping, which allows the flux to uniformly penetrate and coat the interconnector surfaces. This parameter change achieves sufficient flux thickness for improved adhesion while preventing interconnector damage through the gentle dipping action.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures a uniform and sufficient flux coating on interconnectors, enhancing their adhesion to solar cells, thereby improving the overall performance and reliability of solar cell panels.
Implementation Method 1
a flux bath for receiving a flux and having an inlet and an outlet configured to allow an interconnector to pass below a surface of the flux
Implementation Method 2
The flux is coated by a dipping process through moving the interconnector in the flux from the inlet to the outlet
Data Source
AI summary
A flux coating device for a solar cell panel, can include a flux bath configured to receive flux and having an inlet and an outlet, in which the inlet and the outlet of the flux bath are configured to pass an interconnector below a surface of the flux, and the interconnector can include a wiring material including: a rounded portion or a circular cross-section, a core layer, and a solder layer formed on a surface of the core layer.


