Solar Module Cover Layer Separation With Differential Thermal Control
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Solution Overview
Problem
Existing methods for recycling solar modules are limited in their applicability, particularly for those with a silicon substrate, as they do not effectively separate the cover layer from the base body without damaging the cover layer or releasing harmful gases.
Innovation Solution
A method involving heating the adhesive layer to a specific temperature while cooling the lower side of the base body to prevent damage to lower-side layers and release of harmful gases, allowing the cover layer to be removed without damaging it, and enabling access to underlying conductor tracks for recycling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the adhesive layer is heated to remove the cover layer, then the cover layer can be separated from the base body, but the plastic layer on the lower side may disintegrate and release harmful gases
Solution Approach 1:
The patent applies different temperature treatments to different regions of the layer element: the adhesive layer is heated to high temperature (150-400°C) to reduce adhesive force and enable cover layer removal, while the plastic layer on the lower side is cooled to low temperature (below 0°C) to prevent disintegration and harmful gas release. This localized differential temperature control resolves the contradiction between effective separation and harm prevention.
2Ease of manufacture
If the adhesive layer is heated to a high temperature, then the adhesive force decreases and cover layer removal is enabled, but the plastic layer material may disintegrate
Solution Approach 1:
The patent implements localized temperature control where the adhesive layer experiences high temperature heating (150-400°C) to reduce adhesive force, while the plastic layer on the lower side experiences cooling (below 0°C) to maintain its structural integrity and prevent disintegration. This spatial differentiation of thermal conditions allows simultaneous achievement of cover layer removal and plastic layer protection.
Solution Approach 2:
The patent applies preliminary cooling to the plastic layer before and during the heating process of the adhesive layer. This preemptive cooling action prevents the plastic layer from disintegrating when the adhesive layer is heated, thereby protecting against the harmful effect before it can occur.
3Ease of manufacture
If mechanical removal methods are used to separate layers, then the cover layer can be removed, but the method cannot be applied to all solar modules with silicon base bodies
Solution Approach 1:
The patent changes the physical state and properties of the adhesive layer by heating it to high temperature (150-400°C), which fundamentally alters the adhesive force characteristics and enables thermal separation. This parameter change allows the method to be applied universally to different solar module types with silicon base bodies, overcoming the limitations of mechanical removal methods that are not universally applicable.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient separation of the cover layer from the base body, preserving the cover layer integrity and preventing harmful gas release, thus facilitating the recovery of valuable conductor track materials.
Implementation Method 1
the adhesive layer is heated to an adhesive layer temperature
Implementation Method 2
the lower side of the base body is cooled to a lower side temperature
Implementation Method 3
The heat introduced into the adhesive layer spreads inside the layer element and gradually heats other layers and elements of the layer element
Data Source
AI summary
The invention relates to a method for processing a layer element, wherein the layer element has at least one base body with a lower side and an upper side opposite the lower side, a cover layer that is at least partially transparent to visible light, and at least one adhesive layer arranged between the cover layer and the upper side, wherein, during the method, the adhesive layer is heated to an adhesive layer temperature and the lower side of the base body is cooled to a lower side temperature.