Solar Panel Interconnect Foil Local Protective Layer Removal
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Solution Overview
Problem
Existing solar panel assembly methods are not suitable for integrating electronic components like power converters and drivers into the solar panel without increasing manufacturing costs or compromising temperature stability.
Innovation Solution
A method involving an interconnect foil with a protective layer on one side, where the layer is locally removed to expose contact pads for assembling electronic components, allowing for integration during the assembly process, including the use of optical removal means like lasers for precise exposure and alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If electronic components are integrated into the solar panel, then functionality is enhanced, but manufacturing complexity increases
Solution Approach 1:
The protective layer is locally removed in advance at specific positions on the interconnect foil before the lamination process. This preliminary exposure of contact pads allows electronic components to be integrated during the normal assembly process without requiring additional manufacturing steps, thereby enhancing functionality while controlling manufacturing complexity
Solution Approach 2:
The protective layer serves as an intermediary element that enables selective exposure of contact pads. By removing this layer only at necessary locations, the patent facilitates the integration of electronic components through the existing lamination process, avoiding the need for separate assembly operations and thus managing manufacturing complexity
2Adaptability or versatility
If the protective layer is locally removed to expose contact pads, then electronic component integration is enabled, but manufacturing process complexity increases
Solution Approach 1:
The protective layer is removed only at specific local positions where electronic components need to be integrated, rather than removing it entirely or uniformly. This localized approach enables component integration capability while minimizing the impact on the overall manufacturing process, as the removal is performed only where necessary using standard equipment
3Manufacturing precision
If optical removal means are used to expose contact pads, then precision is improved, but equipment complexity increases
Solution Approach 1:
Optical removal means, such as laser ablation, are used to remove the protective layer instead of mechanical methods. This substitution provides precise control over the removal process, enabling accurate exposure of contact pads at predetermined positions. The optical method achieves high manufacturing precision while the process can be integrated into existing manufacturing equipment, thereby limiting the increase in equipment complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the integration of electronic components into solar panels without reducing yield or compromising temperature stability, enhancing panel functionality while maintaining efficiency and reliability.
Implementation Method 1
the protective layer is removed locally by means of optical removal means, such as a laser
Data Source
Figure 1~3
Figure 4
AI summary
The assembly line for electronic devices, particularly solar panels, comprises a station provided with an optical material removal means (121), and a carrier table (20) for carrying a interconnect foil (4) comprising a pattern of electrical conductors and contact pads (16, 44), with on its second side (42) a protective layer to be locally removed so as to expose said contact pads (44), to a first side (41) of which interconnect foil (4) further layers (6, 10) and elements (8, 11) may be assembled, wherein the carrier table (20) is a mobile carrier table that is movable in a plane substantially normal to a direction of radiation to be emitted by the optical material removal means (121), which mobile carrier table (20) is provided with an access window (21), through which radiation emitted by the optical material removal means (121) can arrive at protective layer (43).