Solar Substrate Texture Formation via Combined Cleaning and Etching
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Solution Overview
Problem
The existing methods for manufacturing solar-power-generator substrates require multiple processing devices and involve redundant drying processes, leading to increased chemical solution costs and inefficiencies in forming a uniform texture structure with low light reflectance.
Innovation Solution
A method involving a cleaning step with an oxidizing chemical to remove organic and metal impurities, followed by anisotropic etching with an alkaline aqueous solution to form a texture structure on the semiconductor substrate, thereby eliminating the need for separate damaged layer removal and reducing chemical solution consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a separate damaged layer removal step is performed using alkali solution or mixed acid, then the damaged layer is removed and organic/metal impurities are cleaned, but additional processing devices and drying processes are required, increasing process complexity and chemical solution costs
Solution Approach 1:
The patent combines the damaged layer removal function and the texture formation function into a single etching step using an alkaline aqueous solution. This merging eliminates the need for separate processing devices and redundant drying processes, directly reducing device complexity while maintaining the reliability of damaged layer removal.
Solution Approach 2:
The alkaline aqueous solution used for texture formation is designed to simultaneously perform multiple functions: removing the damaged layer, cleaning organic and metal impurities, and forming the texture structure. This multi-functionality reduces the number of required processing devices and chemical solutions, addressing the contradiction between reliability and device complexity.
2Object-affected harmful factors
If the substrate is left in air after damaged layer removal, then organic impurities and metal impurities adhere to the exposed silicon surface, but forming a chemical oxide film to prevent adhesion requires additional processing devices and drying steps
Solution Approach 1:
The patent maintains continuous protection of the silicon surface by performing texture formation immediately after damaged layer removal without exposing the substrate to air. The alkaline aqueous solution continuously acts on the surface, preventing impurity adhesion while forming the texture, thereby eliminating the need for drying processes and reducing time loss.
Solution Approach 2:
The patent applies the alkaline aqueous solution immediately after damaged layer removal to preemptively prevent impurity adhesion. By performing the texture formation step continuously without air exposure, the solution acts preliminarily to protect the surface before impurities can adhere, eliminating the need for subsequent drying steps.
3Manufacturing precision
If multiple processing steps are performed with separate devices, then each step can be optimized, but redundant drying processes increase chemical solution consumption and manufacturing costs
Solution Approach 1:
The patent merges multiple processing steps (damaged layer removal, impurity cleaning, and texture formation) into a single etching step using an alkaline aqueous solution. This consolidation eliminates redundant drying processes between steps, reducing chemical solution consumption while maintaining the manufacturing precision required for high-quality texture structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of a high-quality solar-power-generator substrate with low light reflectance and a uniform texture structure at a lower cost, while preventing contaminant adhesion and extending the etchant replacement period.
Implementation Method 1
a cleaning step of cleaning and removing an organic impurity and a metal impurity adhering to the surface of the semiconductor substrate with a cleaning fluid containing an oxidizing chemical
Implementation Method 2
forming a texture structure on the surface of the semiconductor substrate by performing anisotropic etching on the surface of the semiconductor substrate with an alkaline aqueous solution
Data Source
AI summary
A method for manufacturing a solar-power-generator substrate by cutting out a semiconductor substrate by slicing a semiconductor ingot and then by forming a texture structure on a surface of the semiconductor substrate by performing a surface treatment on the surface of the semiconductor substrate, includes: cleaning including cleaning and removing an organic impurity and a metal impurity adhering to the surface of the semiconductor substrate with a cleaning fluid containing an oxidizing chemical; and etching including removing a damaged layer on a substrate surface generated by the slicing and forming the texture structure on the surface of the semiconductor substrate by performing anisotropic etching on the surface of the semiconductor substrate with an alkaline aqueous solution, the etching being performed subsequent to the cleaning.