Solder Component Asymmetric Lead Design for Mounting Stability
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Solution Overview
Problem
Conventional solder components used in surface-mount technology are unstable due to variations in projection shapes, leading to potential connection failures under external forces, as the center of mass is not consistently supported by specific projections.
Innovation Solution
The solder component design includes terminal members with bending portions and substrate connection portions, where three of the connection portions have narrower widths than the bending portions, ensuring the center of mass is always within a triangle formed by their contact points, providing stability and consistent support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If projections are provided on all lead portions to ensure support, then the solder component can be supported by multiple projections, but variation in projection shapes causes unpredictable contact points leading to instability
Solution Approach 1:
The invention applies asymmetry by providing projections on only three specific lead portions (first, second, and third lead portions) rather than all eight lead portions. This asymmetric configuration creates a deterministic triangular support base whose contact points consistently form a triangle containing the center of mass, eliminating the unpredictability caused by symmetric projections on all leads that vary due to manufacturing tolerances.
Solution Approach 2:
The invention applies local quality by selectively adding projections only to specific lead portions (first, second, and third) that are strategically positioned to form a stable triangular support base. The fourth lead portion intentionally lacks a projection, creating localized differentiation in the support structure. This selective placement ensures that the three contact points consistently define a stable triangle containing the center of mass.
2Quantity of substance
If eight lead portions with projections are used, then more contact points are available, but the center of mass may fall outside the triangle formed by three contact points causing instability
Solution Approach 1:
The invention applies the taking out principle by removing projections from five of the eight lead portions, retaining them only on three specific lead portions (first, second, and third). This extraction eliminates the problem of having too many potential contact points that could form unstable configurations. The center of mass is guaranteed to be within the triangle formed by the three retained projections, ensuring stable attitude.
3Ease of manufacture
If projections are made uniform in design, then manufacturing is simplified, but burrs and shape variations determine unpredictable contact points
Solution Approach 1:
The invention resolves this contradiction by applying asymmetry - instead of making all projections identical, it strategically places projections on only three specific lead portions. This asymmetric configuration transforms manufacturing variations from a source of unpredictability into a non-issue, because the three predetermined contact points consistently form a stable triangular base containing the center of mass, regardless of minor burrs or shape variations.
Data Source
AI summary
A solder component includes one or more terminal members each having a bending portion bending in a direction crossing a surface of a substrate and being connected to the surface of the substrate, and four or more substrate connection portions formed at end portions of the terminal members, three substrate connection portions out of the four or more substrate connection portions each having a width narrower than a width of the bending portion of the corresponding terminal member, when the solder component is disposed on the surface of the substrate, only the three substrate connection portions being in contact with the surface of the substrate, and no matter where a contact point contacting the surface of the substrate is provided on each substrate connection portion, a mass center of the solder component being located inside a triangle determined by three contact points of the three substrate connection portions.