Electronic Package Solder Ball Rework for Precise Array Replacement
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Solution Overview
Problem
Conventional electronic packages often become unsuitable for use due to manufacturing flaws such as missing, misaligned, or damaged solder balls, leading to waste and increased costs.
Innovation Solution
A method and system for replacing solder balls by collectively heating the existing solder balls to melt them, using suction to remove them, and then positioning and reflowing replacement solder balls to form a metallurgical bond with the seats, utilizing a fluxing agent and specialized tools like a hot plate assembly and mask with apertures to ensure accurate placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder balls are replaced individually, then manufacturing precision is improved, but productivity deteriorates due to time-consuming manual operations
Solution Approach 1:
The patent combines multiple solder ball replacement operations into a single collective heating process. Instead of heating and replacing each solder ball individually, the entire array of solder balls is heated simultaneously using a hot plate assembly, allowing parallel processing that maintains precision while dramatically improving productivity
Solution Approach 2:
The patent applies fluxing agent to the solder balls before heating to facilitate easier removal. This preliminary action prepares the solder joints for the subsequent collective heating and removal process, ensuring that the solder balls can be cleanly removed and replaced without damaging the underlying circuit board traces
2Reliability
If flawed electronic packages are discarded, then reliability is maintained, but loss of substance increases due to material wastage
Solution Approach 1:
The patent recovers and reuses solder ball material by collecting the old solder balls after removal and incorporating them into the replacement process. This reduces material waste while maintaining the reliability of the electronic package through proper replacement of defective solder balls
Solution Approach 2:
The patent converts the harmful effect of manufacturing flaws (defective solder balls) into a beneficial opportunity for repair and improvement. By providing a systematic method to identify and replace only the flawed solder balls rather than discarding the entire package, the process transforms potential waste into value retention
3Ease of operation
If collective heating is applied to melt solder balls, then ease of operation is improved, but temperature control becomes more complex
Solution Approach 1:
The patent introduces fluxing agent as an intermediary substance between the heating process and the solder balls. The flux lowers the melting point of the solder and facilitates easier removal during collective heating, reducing the complexity of temperature control while improving ease of operation
Solution Approach 2:
The patent uses suction (pneumatic action) through a needle to remove the melted solder balls after collective heating. This pneumatic mechanism simplifies the removal process and reduces the need for precise temperature control, as the suction force assists in extracting the softened solder balls from their positions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electronic package disposal and material wastage by allowing for the repair of flawed packages, extending their usability and reducing raw material costs.
Implementation Method 1
collectively heating the array of solder balls to melt the solder balls
Implementation Method 2
removing each one of the array of solder balls from the corresponding seat by application of suction to the respective melted solder ball
Implementation Method 3
collectively heating the array of seated replacement solder balls such that the replacement solder balls reflow and form a metallurgical bond with the seats
Implementation Method 4
the replacement solder balls reflow and form a metallurgical bond with the seats
Data Source
AI summary
A method for replacement of solder balls of an electronic package soldered to seats located on a surface of the electronic package. The method comprises collectively heating the solder balls to melt the solder balls, removing each one of the solder balls from the corresponding seats by suction, providing a plurality of replacement solder balls, for each seat, positioning a corresponding one of the replacement solder balls on the respective seat to form an array of seated replacement solder balls, and collectively heating the array of seated replacement solder balls such that the replacement solder balls reflow and form metallurgical bonds with the seats. A system for replacing solder balls of an electronic package is also provided. An assembly for use in locating a plurality of solder balls onto an array of seats of an electronic package is also provided.