Solder Ball X-Ray Inspection Using Edge Distance Analysis
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing X-ray imaging systems struggle to accurately determine the shape of solder balls, particularly when they have local convex or concave shapes, as traditional methods based on roundness calculations may not differentiate between proper and improper shapes.
Innovation Solution
A board inspection system and method that utilizes an X-ray imaging apparatus and an inspection apparatus to generate a determination image, determining solder ball shape by measuring distances from the center of gravity to the outer edge parts of the solder ball area, using index values and thresholds to differentiate between proper and improper shapes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If roundness calculation is used to determine solder ball shape, then the inspection process is simple, but the measurement precision is insufficient for detecting local convex/concave shapes
Solution Approach 1:
The solder ball area is divided into multiple edge parts, and distances are calculated from the center of gravity to each edge part separately. This segmentation allows detection of local shape variations (convex/concave portions) that would be missed by a single roundness calculation, thereby improving measurement precision while maintaining operational simplicity through automated processing.
2Measurement precision
If multiple distance measurements are taken from center of gravity to outer edge parts, then the measurement precision improves for detecting improper shapes, but the device complexity increases
Solution Approach 1:
The patent replaces complex mechanical measurement systems with an X-ray imaging system combined with image processing algorithms. The controller automatically calculates multiple distances from the center of gravity to outer edge parts in the determination image, achieving high measurement precision through computational methods rather than mechanical complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Accurately distinguishes between proper and improper solder ball shapes, even with local convex or concave features, by analyzing distances from the center of gravity to the outer edges, enhancing the precision of shape determination.
Implementation Method 1
an X-ray imaging apparatus performing X-ray imaging of a board on which a solder ball is placed
Data Source
AI summary
A board inspection system according to this invention includes an X-ray imaging apparatus performing X-ray imaging of a board on which a solder ball is placed; and a board inspection apparatus including an inspection apparatus controller generating an X-ray image of the board, wherein the inspection apparatus controller generates a determination image based on the X-ray image of the board, and determines whether a shape of the solder ball is proper or improper based on a plurality of distances from a center of gravity G of a solder ball area to a plurality of outer edge parts of the solder ball area in the determination image.