Semiconductor Package Solder Ball Guide Member
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor package apparatuses face challenges in achieving a super-fine pitch between solder balls due to soldering defects such as overflow and shorts, which are not effectively prevented by current connection methods.
Innovation Solution
The semiconductor package apparatus employs a solder resist layer with guide surfaces around the terminals to guide the shape of package connecting solder balls, and a molded underfill member with inclined guide surfaces to prevent overflow and shorts, ensuring precise alignment and connection between stacked packages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional connection methods are used to connect stacked packages, then the manufacturing process is simple, but soldering defects such as overflow and shorts occur, preventing super-fine pitch achievement
Solution Approach 1:
The patent introduces a solder ball guide member as an intermediary structure between the terminal and the solder ball. This guide member includes guide surfaces that physically constrain the solder ball during the soldering process, preventing overflow and shorts while enabling super-fine pitch connections. The guide member acts as a mediator that facilitates precise solder ball placement without requiring complex manufacturing processes.
2Productivity
If the pitch between solder balls is reduced to achieve super-fine connection, then the connection density increases, but soldering defects such as overflow and shorts become more likely
Solution Approach 1:
The solder ball guide member implements local quality by providing targeted guidance and constraint only at the critical solder ball location. The guide surfaces are locally positioned around the terminal area where solder ball placement is most critical, while other areas of the package remain unaffected. This localized approach enables super-fine pitch connections without requiring complex modifications throughout the entire package structure.
3Reliability
If guide structures are added to prevent soldering defects, then soldering reliability improves, but the device complexity increases
Solution Approach 1:
The patent segments the package structure by separating the solder ball guide function from the main package components. The solder ball guide member is introduced as a distinct, independent element that can be separately manufactured and then integrated into the package. This segmentation allows the guide function to be optimized for reliability without complicating the overall package design, as the guide member is a simple, focused structure rather than a complex integrated system.
Data Source
AI summary
A semiconductor package apparatus includes a first semiconductor package including a first semiconductor chip, a first substrate, a first terminal, and a first signal transfer medium, and a second semiconductor package including a second semiconductor chip, a second substrate, a second terminal, and a second signal transfer medium. At least one package connecting solder ball is located between the first terminal and the second terminal. A first solder ball guide member is positioned around the first terminal of the first substrate and includes a first guide surface for guiding a shape of the package connecting solder ball.