Solder Ball Interface for QFP to PCB Connection
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Solution Overview
Problem
Existing methods for connecting quad-flat packages (QFPs) to printed circuit boards face challenges such as size mismatches, differing manufacturing temperatures, and compliance with hazardous substance regulations, particularly when direct soldering is not feasible or compliant.
Innovation Solution
An intercoupling component with an insulating support member featuring first and second electrical attachment sites connected by via holes, using multiple solder balls arranged in a pattern corresponding to the QFP leads to establish electrical connections, providing mechanical stability and preventing short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If direct soldering is used to connect QFP leads to PCB pads, then the connection process is simple and fast, but size mismatches and manufacturing temperature differences prevent reliable connections
Solution Approach 1:
The patent introduces an intermediate intercoupling device between the QFP package and the PCB. This device includes a first interface that connects to the QFP leads and a second interface that connects to the PCB pads, serving as a mediator that accommodates size mismatches and different manufacturing temperatures while ensuring reliable electrical and mechanical connections.
2Adaptability or versatility
If an intermediate intercoupling device is used to connect QFP to PCB, then size mismatches and manufacturing temperature differences are accommodated, but the connection process becomes more complex
Solution Approach 1:
The patent merges multiple functions into the intercoupling device: mechanical support, electrical connection, alignment, and thermal management are all integrated into a single component structure. This reduces the overall system complexity despite the added adaptability for size and temperature mismatches.
3Object-affected harmful factors
If lead-free components are used to comply with RoHS regulations, then hazardous substance content is reduced, but compatibility with lead-containing PCBs is compromised
Solution Approach 1:
The intercoupling device serves as an intermediary that connects lead-free QFP components to lead-containing PCBs. The device structure and material composition are designed to be compatible with both types of components, enabling RoHS compliance while maintaining reliable electrical and mechanical connections across heterogeneous materials.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The intercoupling component enables reliable, compliant connections between QFPs and printed circuit boards, ensuring mechanical stability and preventing electrical shorts, while allowing for independent manufacturing and assembly of QFPs, and accommodating size and material mismatches.
Implementation Method 1
each of the second electrical attachment sites including a plurality of solder balls associated with each device lead
Data Source
AI summary
An intercoupling component is provided that electrically connects the device leads of an integrated circuit package to a substrate. The package includes external device leads, each device lead having a downwardly extending section proximate a side of the package body, and the intercoupling component includes an insulating support member. The support member includes a first surface including first electrical attachment sites, each configured for making an electrical connection with a corresponding one of the device leads of the package. The support member also includes an opposite second surface including second electrical attachment sites in electrical contact with the first electrical attachment sites, each of the second electrical attachment sites including a plurality of solder balls associated with each device lead. The plurality of solder balls are used to form an electrical connection between each surface mount pad on the substrate and the corresponding conductive pad of the intercoupling component.