Multi-Layer Solder Ball Mask for Contamination Prevention
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Solution Overview
Problem
Existing solder ball mounting technologies face challenges in miniaturization and increased terminal density for electronic components, leading to issues with contamination and reduced productivity due to flux adherence in mask openings.
Innovation Solution
A solder ball mounter with a solder ball mask featuring a layered structure, including an upper mask layer with a smaller diameter opening, a middle mask layer with a larger diameter opening, and a lower mask layer, which reduces contamination and maintains stability during the mounting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional single-layer mask is used for solder ball mounting, then the structure is simple and easy to manufacture, but the mask openings become contaminated by flux and other materials, reducing productivity and stability
Solution Approach 1:
The mask structure is divided into multiple layers (upper mask layer, middle mask layer, lower mask layer) with each layer having specific functions. The upper layer has smaller openings for precise solder ball placement, the middle layer has larger openings to prevent flux contamination, and the lower layer provides structural support. This segmentation allows each layer to address specific problems independently.
Solution Approach 2:
The solution transitions from a two-dimensional single-layer mask to a three-dimensional multi-layer mask structure. By adding the vertical dimension with multiple stacked layers, the system achieves both precise alignment (through the upper layer's smaller openings) and contamination prevention (through the middle layer's larger openings) simultaneously.
2Manufacturing precision
If the mask opening diameter is reduced for precise solder ball alignment, then mounting precision is improved, but flux and other materials more easily contaminate the smaller openings, reducing productivity
Solution Approach 1:
The mask is segmented into functional layers: the upper mask layer contains smaller diameter openings for precise solder ball alignment, while the middle mask layer contains larger diameter openings that prevent flux contamination. This segmentation allows the system to simultaneously achieve high precision and maintain productivity.
Solution Approach 2:
The middle mask layer acts as an intermediary between the upper precision layer and the lower support layer. Its larger openings serve as a protective barrier that prevents flux from reaching and contaminating the smaller openings in the upper layer, while still allowing solder balls to pass through to the substrate.
3Productivity
If a multi-layer mask structure is used to prevent contamination, then productivity and stability are improved, but the device complexity and manufacturing difficulty increase
Solution Approach 1:
The multi-layer mask is segmented into modular units (upper, middle, and lower layers) that can be manufactured separately and then assembled. Each layer can be optimized for its specific function, and the modular design simplifies the overall manufacturing process compared to creating a single complex monolithic structure.
Solution Approach 2:
The mask layers are arranged in a nested configuration where the upper mask layer, middle mask layer, and lower mask layer are stacked vertically with their openings aligned. This nesting approach allows for compact design and simplifies the assembly process, as each layer fits within the overall boundary of the previous layer.
Data Source
AI summary
An solder ball mounter includes a stage configured to support a substrate, a ball placer head configured to provide solder balls, and a solder ball mask configured to align the solder balls with the substrate. The solder ball mask includes an upper mask layer including an upper opening having a first diameter, a middle mask layer including a middle opening having a second diameter that is larger than the first diameter, and a lower mask layer.