Solder Ball Mask Layout for Variable-Pitch Substrate Mounting
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Solution Overview
Problem
Existing methods for mounting solder balls on substrates, such as printed circuit boards, face challenges in efficiently accommodating the increased number of connection terminals due to miniaturization and thinning of electronic components, particularly in high-integration electronic devices.
Innovation Solution
An apparatus is provided that includes a stage, a mounting unit, and a solder ball mask with through-holes of varying spacings and alignments to precisely place solder balls on a substrate, allowing for varied pitch arrangements and efficient mounting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If solder balls are mounted using conventional pick and place methods, then the mounting process is simple, but it cannot accommodate the increased number of connection terminals required for high-integration electronic devices
Solution Approach 1:
A solder ball mask is introduced as an intermediary component between the mounting unit and the substrate. The mask includes multiple through-holes with different first spacings and second spacings, enabling precise positioning of solder balls at varying pitches. This intermediary structure allows the mounting system to accommodate high-density connection terminals without increasing overall system complexity
Solution Approach 2:
The solder ball mask is segmented into multiple through-holes, each with specific spacing configurations. The first openings have different spacings from the second openings, allowing different regions of the substrate to receive solder balls at appropriate pitches. This segmentation enables the system to handle varied terminal densities across different areas of the electronic device
2Adaptability or versatility
If solder balls are placed at varying pitches, then high-integration requirements are met, but alignment precision becomes more difficult to achieve
Solution Approach 1:
The solder ball mask implements local quality by providing different spacing configurations at different locations. Through-holes are arranged with first spacings in one direction and second spacings in another direction, allowing each region of the substrate to receive solder balls at the precise pitch required for that specific area. This local customization of spacing maintains high alignment precision while accommodating varied pitch requirements
3Quantity of substance
If the number of through-holes with different spacings is increased, then more solder ball positions are accommodated, but the mask structure becomes more complex
Solution Approach 1:
The solder ball mask is designed with multi-functionality, serving as both a positioning template and a spacing controller. By incorporating through-holes with different first and second spacings in a single mask structure, the system can accommodate multiple solder ball positions with varied pitches using one universal component rather than multiple specialized components, thereby reducing overall structural complexity
Data Source
AI summary
An apparatus for mounting solder balls comprises a stage to support a substrate thereon, a mounting unit to mount solder balls on the substrate, and a solder ball mask between the mounting unit and the substrate. The solder ball mask includes a first face facing the substrate and a second face opposite to the first face. The solder ball mask has inner surfaces defining through-holes extending through a thickness of the solder ball mask from the second face to the first face. The apparatus causes the solder balls to move through separate, respective through-holes. Each of the through-holes includes a first opening defined in the first face and a second opening defined in the second face. A first spacing between adjacent first openings of the plurality of through-holes is different from a second spacing between adjacent second openings of the through-holes.