Solder Ball Attachment Layout for Misalignment Compensation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The challenge in semiconductor manufacturing is to reduce the size of solder balls while maintaining high reliability and electrical performance, particularly due to misalignment and expansion/contraction issues in the solder ball attaching process.
Innovation Solution
A method is introduced to estimate errors in the solder ball attaching process, determine the specification of the ball tool and process, and adjust the tool and substrate regions accordingly, including dividing the substrate into multiple working regions and aligning tool regions to these areas for precise solder ball attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of solder ball is reduced to meet compact electronic component requirements, then the compactness of electronic product is improved, but the misalignment error in solder ball attaching process becomes more significant
Solution Approach 1:
The substrate is divided into multiple working regions, and the ball tool is divided into multiple tool regions with multiple holders. This segmentation allows for more precise control and alignment in each smaller region, compensating for the reduced tolerance margin when using smaller solder balls.
Solution Approach 2:
The patent changes the parameters of the ball tool by adjusting the number of holders, their positions, and widths based on the estimated error in the solder ball attaching process. This parameter optimization ensures precise placement even with smaller solder balls.
2Manufacturing precision
If the number of holders and working regions is increased to improve placement precision, then the solder ball attaching precision is improved, but the device complexity increases
Solution Approach 1:
By dividing the substrate into multiple working regions and the ball tool into multiple tool regions with corresponding holders, the patent achieves precise control in each segment while maintaining an organized and manageable overall structure.
Solution Approach 2:
The patent performs preliminary error estimation of the solder ball attaching process before manufacturing the ball tool. This allows the holders and working regions to be pre-configured with optimal positions and widths, avoiding the need for complex real-time adjustments during the actual attaching process.
3Reliability
If error estimation and compensation measures are implemented, then the reliability of semiconductor package is improved, but the manufacturing process complexity increases
Solution Approach 1:
The patent performs error estimation and determines the optimal ball tool specification and attaching method before actual manufacturing. This preliminary planning ensures high reliability by compensating for expected errors in advance, while keeping the actual manufacturing process straightforward by using pre-determined parameters.
Solution Approach 2:
The patent uses error estimation as a feedback mechanism to optimize the ball tool design and attaching process parameters, ensuring that the system compensates for expected deviations and achieves reliable solder ball placement.
Data Source
AI summary
A method of manufacturing a semiconductor package includes estimating an error in a solder ball attaching process, determining a specification of a ball tool and a method of the solder ball attaching process, based on the estimated error, manufacturing the ball tool according to the determined specification thereof, and performing the solder ball attaching process based on the method of the solder ball attaching process. The determining of the specification of the ball tool and the method of the solder ball attaching process includes determining a number of a plurality of holders in the ball tool and a position and a width of each of the plurality of holders, determining a number of a plurality of working regions of a substrate and a position and a width of each of the plurality of working regions, and dividing a substrate into the plurality of working regions.