Solder Ball Mounting Device with Airflow Regulation
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Solution Overview
Problem
Existing solder ball mounting devices face challenges in accurately placing solder balls with diameters less than 200 μm on printed circuit boards, leading to variations in solder bump height and reduced yield rates due to turbulent airflow, which causes solder balls to collide and become dismounted or unevenly attached.
Innovation Solution
A solder ball mounting device featuring a cylindrical member with a current plate to regulate airflow, preventing turbulent flow and ensuring consistent suction speed, combined with a mask for arraying balls and a movement mechanism to precisely drop solder balls onto connection pads, ensuring even attachment and high yield rates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If squeegees are used to mount solder balls on connection pads, then the mounting process can be completed, but the quality of the printed circuit board is lowered due to variation in height of solder bumps when solder balls have smaller diameters than sand grains with a diameter of 200 μm
Solution Approach 1:
The patent replaces the mechanical squeegee-based mounting system with a pneumatic system using a cylindrical member that generates negative pressure to suck and hold solder balls. This substitution eliminates the mechanical contact and pressure variations that cause uneven solder bump heights, particularly for small-diameter solder balls less than 200 μm.
Solution Approach 2:
The patent employs pneumatic principles by using a cylindrical member with air suction capability to gather and hold solder balls through negative pressure. The pneumatic system provides uniform and controlled force distribution across multiple solder balls, ensuring consistent placement and uniform solder bump formation without the variability inherent in mechanical squeegee methods.
2Productivity
If air is sucked in to gather solder balls, then solder balls can be mounted on the printed circuit board, but turbulent airflow causes solder balls to collide and become dismounted or unevenly attached
Solution Approach 1:
The patent introduces a mask with openings as an intermediary element between the cylindrical member and the solder balls. The mask regulates and smooths the airflow, preventing direct turbulent contact between the suction force and the solder balls. This intermediary structure ensures uniform air distribution and prevents solder ball collisions while maintaining effective mounting capability.
Solution Approach 2:
The patent modifies the airflow parameters by using the mask to distribute and smooth the air flow pattern. The mask changes the velocity and pressure distribution of the air, transforming turbulent flow into a more uniform laminar flow that can effectively transport solder balls without causing collisions or dismounting.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively mounts minute solder balls on printed circuit boards with certainty, maintaining even solder bump heights and preventing collisions, thus enhancing the reliability and quality of electronic components, especially on multilayer boards with undulations.
Implementation Method 1
a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings
Implementation Method 2
A solder ball mounting device featuring a cylindrical member with a current plate to regulate airflow, preventing turbulent flow and ensuring consistent suction speed
Data Source
AI summary
A solder ball mounting device that can mount minute solder balls with a diameter of 200 μm or less onto a connection pad. The solder ball mounting device can mount solder balls to be solder bumps on a printed circuit board using a mask having a plurality of openings corresponding to electrodes of a printed circuit board. The device includes a cylindrical member, which is positioned above the mask for arraying solder balls, for gathering solder balls immediately below the openings by sucking in air from the openings. A movement mechanism is for moving the cylindrical member horizontally relative to the mask for arraying solder balls, wherein solder balls gathered on the mask for arraying solder balls are moved by moving the cylindrical member and are then dropped on electrodes of the printed circuit board via openings of the mask for arraying solder balls. A current plate is placed within the cylindrical member, wherein at least a part of the current plate is positioned in an inner space formed by inner walls of the cylindrical member.