Solder Ball Replacement Assembly for Precise Package Rework
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Solution Overview
Problem
Conventional electronic packages often become unsuitable for use due to manufacturing flaws such as missing, misaligned, or damaged solder balls, leading to waste and increased costs.
Innovation Solution
A method and system for replacing solder balls by collectively heating the existing solder balls to melt them, using suction to remove them, and then positioning and reflowing replacement solder balls to form a metallurgical bond with the seats, utilizing a fluxing agent and specialized tools like a hot plate assembly and mask with apertures to ensure accurate placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder balls are manually removed and replaced individually, then manufacturing precision can be maintained, but productivity is severely reduced and labor costs increase
Solution Approach 1:
The patent combines multiple functions into integrated tools: the heating element and suction tool are merged into a single device for simultaneous melting and removal of solder balls. The mask assembly combines positioning features with the heating tool, allowing precise placement of replacement solder balls while maintaining high throughput. This integration eliminates the need for separate manual operations for each solder ball replacement.
Solution Approach 2:
The mask is segmented into multiple apertures corresponding to different solder ball positions, allowing simultaneous access to multiple seats. The array of seats is divided into manageable sections that can be processed in parallel. This segmentation enables batch processing of solder ball replacements while maintaining precise positioning for each individual ball.
2Ease of manufacture
If conventional soldering processes are used, then manufacturing simplicity is maintained, but reliability is reduced due to manufacturing flaws in solder balls
Solution Approach 1:
The patent applies preliminary heating (baking) to the electronic package before the main solder ball replacement process. This preliminary action prepares the substrate and existing solder joints, ensuring they are at the appropriate temperature and condition for the subsequent solder ball melting and replacement operations, thereby preventing defects and improving reliability.
Solution Approach 2:
A fluxing agent is introduced as an intermediary substance during the solder ball replacement process. The fluxing agent facilitates the melting and bonding processes, ensuring proper wetting and metallurgical bonding between the replacement solder balls and the seats. This intermediary substance prevents oxidation and ensures reliable solder joints without complicating the overall manufacturing process.
3Productivity
If all solder balls are replaced collectively, then productivity is improved, but device complexity increases due to specialized equipment requirements
Solution Approach 1:
The heating tool is designed with universal functionality, serving both as a heating element for melting solder balls and as a positioning tool when combined with the mask. The mask assembly can be configured for different solder ball arrays and positions. This multi-functionality allows collective processing of multiple solder balls without requiring separate specialized equipment for each operation, thereby managing device complexity while maintaining high productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces electronic package disposal and material wastage by effectively replacing flawed solder balls, ensuring the package meets design specifications and is suitable for intended use.
Implementation Method 1
collectively heating the array of solder balls to melt the solder balls
Implementation Method 2
removing each one of the array of solder balls from the corresponding seat by application of suction to the respective melted solder ball
Implementation Method 3
collectively heating the array of seated replacement solder balls such that the replacement solder balls reflow and form a metallurgical bond with the seats
Implementation Method 4
the replacement solder balls reflow and form a metallurgical bond with the seats
Data Source
AI summary
A method for replacement of solder balls of an electronic package soldered to seats located on a surface of the electronic package. The method comprises collectively heating the solder balls to melt the solder balls, removing each one of the solder balls from the corresponding seats by suction, providing a plurality of replacement solder balls, for each seat, positioning a corresponding one of the replacement solder balls on the respective seat to form an array of seated replacement solder balls, and collectively heating the array of seated replacement solder balls such that the replacement solder balls reflow and form metallurgical bonds with the seats. A system for replacing solder balls of an electronic package is also provided. An assembly for use in locating a plurality of solder balls onto an array of seats of an electronic package is also provided.