Solder Ball Group Inspection Before Nozzle Pickup
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Solution Overview
Problem
Component mounters face efficiency deterioration when suction nozzles pick up defective solder ball groups, necessitating handling of defective solder balls after supply, which affects production efficiency.
Innovation Solution
A quality determination device and method that includes a first determination section to assess the quality of solder ball groups on a pallet before the suction nozzle picks them up, using imaging and detection to identify defective groups and prevent their pickup.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the suction nozzle picks up target objects from the pallet without quality inspection, then the mounting process can proceed continuously, but defective solder ball groups may be picked up causing production efficiency deterioration
Solution Approach 1:
The patent implements quality determination of solder ball groups before the suction nozzle picks them up. The determination section inspects each solder ball group on the pallet in advance, identifying defective groups beforehand. This preliminary action allows the system to skip defective groups during pickup, preventing production delays while maintaining continuous mounting operations.
Solution Approach 2:
The determination section provides feedback information about the quality status of each solder ball group to the control section. This feedback mechanism enables the system to adjust its pickup operations based on quality data, ensuring that only合格 solder ball groups are selected for mounting, thereby maintaining both productivity and reliability.
2Reliability
If quality determination is performed on all solder ball groups in the pallet, then defective groups can be identified and avoided, but the determination process time increases
Solution Approach 1:
The patent performs quality determination on a selective basis rather than requiring complete inspection of all solder ball groups. The determination section can identify and flag defective groups, and the control section uses this information to skip only the problematic groups. This partial action approach maintains reliability by ensuring defective groups are caught while minimizing the time penalty compared to inspecting every single group.
Data Source
AI summary
A quality determination device is applied to a component mounter including a pallet and a suction nozzle, and includes a first determination section. The pallet includes supply units on which a solder ball group to be supplied to a target region, that is at least a part of a mounting area of a component to be mounted on a board is mounted. The solder ball group being disposed in accordance with electrode positions of the component. The suction nozzle picks up and holds a target object that is a supply unit or a solder ball group mounted on the supply unit, and supplies the target object to the target region of a board. The first determination section determines quality of the solder ball group mounted on at least one supply unit among the multiple supply units arranged in the pallet before the suction nozzle picks up the target object.