Semiconductor Package Solder Ball Polymer Dispersion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current semiconductor package manufacturing methods face challenges in achieving high reliability and efficiency, particularly in forming solder balls that maintain good electrical connections while minimizing process complexity and avoiding damage to materials.
Innovation Solution
The method involves forming a solder ball on an interconnect substrate, covering it with a polymer layer, and creating an opening to expose the solder ball, with polymer particles from the same material as the layer being dispersed within the solder ball, allowing for enhanced electrical connectivity and simplified manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a polymer layer is formed to cover the solder ball, then the solder ball is protected from damage, but the electrical connection becomes difficult to access
Solution Approach 1:
The polymer layer is segmented by forming an opening that exposes the solder ball, allowing the protective layer to cover the solder ball while providing access for electrical connection through the opening
Solution Approach 2:
The polymer layer provides protection in areas where it covers the solder ball, while the opening provides localized access for electrical connection, creating different functional zones in different locations
2Reliability
If multiple manufacturing steps are used to form solder balls with good electrical connections, then connection quality improves, but process complexity increases
Solution Approach 1:
The formation of the polymer layer and the opening formation are combined into a sequential process where the polymer layer is formed first to protect the solder ball, then the opening is formed to provide access, merging protection and access requirements into a unified manufacturing approach
Solution Approach 2:
The polymer layer is formed in advance to cover and protect the solder ball before final connection steps, ensuring protection is established prior to subsequent manufacturing operations
Data Source
AI summary
Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package comprises a substrate, a semiconductor chip on the substrate, an interconnect substrate spaced apart from the semiconductor chip on the substrate and including a conductive member therein, a solder ball on the interconnect substrate and electrically connected to the conductive member, a polymer layer on the interconnect substrate and the semiconductor chip and including an opening through which the solder ball is exposed, and polymer particles in the solder ball and including the same material as the polymer layer.