Packaging Substrate Wiring via Solder Balls and Resin
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Solution Overview
Problem
The existing chip packaging technologies are complex and time-consuming due to the use of electroplating methods for forming conductive vias, which also require significant water usage and generate liquid waste.
Innovation Solution
A method for manufacturing a packaging substrate that uses solder balls and resin-coated copper foils to create wiring layers without the need for conductive vias, simplifying the process and reducing environmental impact by eliminating water consumption and liquid waste treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electroplating method is used to form conductive vias, then electrical connections are achieved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent extracts and eliminates the electroplating process entirely from the manufacturing flow. Instead of forming conductive vias through complex electroplating, the invention uses pre-manufactured PCBs with integrated wiring layers, thereby removing the problematic process step while maintaining electrical connectivity functionality.
Solution Approach 2:
The invention uses pre-manufactured PCBs as copies of the required wiring structure. Rather than creating wiring layers from scratch through electroplating, the patent utilizes existing PCBs that already contain the necessary conductive patterns, stencils, and wiring configurations, significantly simplifying the overall process.
2Reliability
If electroplating method is used to form conductive vias, then electrical connections are achieved, but manufacturing time increases
Solution Approach 1:
The patent applies preliminary action by using pre-manufactured PCBs that already contain the wiring layers, stencils, and conductive patterns before they are incorporated into the final packaging substrate. This eliminates the need to perform electroplating and via formation during the packaging substrate manufacturing process, thereby reducing manufacturing time and improving productivity.
3Reliability
If electroplating method is used, then conductive vias are formed, but water consumption and liquid waste increase
Solution Approach 1:
The patent converts the harm of water-intensive electroplating processes into benefit by completely eliminating the electroplating step. Instead of dealing with wastewater treatment and environmental compliance costs, the invention uses dry, mechanical assembly methods involving pre-manufactured PCBs, thereby converting an environmentally harmful process into an environmentally friendly one while maintaining the functional outcome of creating electrical connections.
Data Source
AI summary
A packaging substrate includes a supporting sheet, a copper foil, a number of connecting pads, a number of solder balls, a resin layer, a wiring layer and a solder mask layer. The copper foil is attached on a surface of the supporting sheet through an adhesive sheet. The connecting pads are formed on the copper foil. The solder balls are formed on the connecting pads. The resin layer infills the gaps between the solder balls. The wiring layer is formed on the resin layer and the solder balls. Terminal portions of the solder balls facing away from the connecting pads are electrically connected to the wiring layer. The solder mask layer is formed on the wiring layer. The solder mask layer defines a number of openings exposing portions of the wiring layer. The portions of the wiring layer exposed through the openings serve as contact pads.