Solder Bath Chamber Layout to Reduce Dross Adhesion
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Solution Overview
Problem
Conventional soldering apparatuses, such as jet and dip soldering systems, face issues with solder oxide (dross) adhering to substrates, leading to reduced commercial value and potential short circuits due to dross accumulation and oxidation during the soldering process.
Innovation Solution
A soldering apparatus with a chamber design that positions the dross near the liquid surface, using an opening on the bottom or side surface to minimize dross passage, and a pump that transports solder from the lower side to the upper side to reduce dross suction and density, along with a ventilation port to manage pressure and prevent dross carryover.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional jet solder bath is used to perform soldering, then soldering can be performed on substrates, but dross adheres to the substrate reducing commercial value and causing potential short circuits
Solution Approach 1:
The solder bath is divided into multiple chambers (first chamber, second chamber, third chamber) separated by partition walls. Each chamber has specific functions: the first chamber receives solder from the pump, the second chamber is the jet soldering zone, and the third chamber receives solder from the second chamber. This segmentation allows dross to be confined to specific chambers while maintaining effective soldering in others.
Solution Approach 2:
A circulation pump serves as an intermediary device that transports solder from the first chamber through the partition wall to the second chamber, and then to the third chamber. The pump creates controlled solder flow paths that prevent dross from reaching the substrate while maintaining soldering functionality.
2Stability of the object's composition
If dross is allowed to float on the solder surface, then dross can be separated from molten solder by density, but dross can still be carried to the substrate by solder flow
Solution Approach 1:
The solder bath is divided into multiple chambers (first chamber, second chamber, third chamber) separated by partition walls. Each chamber has specific functions: the first chamber receives solder from the pump, the second chamber is the jet soldering zone, and the third chamber receives solder from the second chamber. This segmentation allows dross to be confined to specific chambers while maintaining effective soldering in others.
Solution Approach 2:
Different chambers have different local qualities tailored to their functions. The first chamber is designed to receive solder from the pump with minimal disturbance. The second chamber is designed for jet soldering with appropriate solder flow characteristics. The third chamber is designed to receive solder from the second chamber and allow dross to settle. Each chamber's geometry and flow characteristics are optimized for its specific purpose.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces dross adhesion to substrates, maintaining the commercial value of soldered components and preventing short circuits by minimizing dross accumulation and oxidation, while ensuring efficient solder transport and uniform temperature for optimal soldering.
Implementation Method 1
a pump that transports solder from the lower side to the upper side
Implementation Method 2
the dross the specific gravity of which is lower than that of the solder floats in an upper part of the solder and is positioned near the liquid surface of the solder
Implementation Method 3
along with a ventilation port to manage pressure and prevent dross carryover
Data Source
AI summary
A soldering apparatus 100 including: a chamber 120 configured to contain solder and include an opening 122 configured to discharge the solder in a bottom surface or a side surface; a pump 140 configured to transport the solder to the chamber 120; and an inner bath 160 configured to communicate with the opening 120 and perform soldering using the solder fed through the opening 120.