Solder Blade Heatsink Attachment for PCB Thermal Management
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Solution Overview
Problem
Densely packed electrical and optoelectronic components, such as LEDs in display systems, generate significant heat, which can lead to elevated operational temperatures, reducing their performance and lifespan if not properly dissipated, and existing attachment methods like screws and glues are not suitable for components with limited space.
Innovation Solution
A method of attaching heatsinks to printed circuit boards (PCBs) using solder blades and removable clips, eliminating the need for screws and glues, allowing for efficient thermal management without occupying space between densely packed components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If screws or glues are used to attach heatsinks, then the heatsink attachment is secure, but the attachment method occupies space between densely packed components and is not suitable for limited space configurations
Solution Approach 1:
The patent transitions from planar attachment (screws/glues on the surface) to three-dimensional attachment by extending solder blades vertically through the PCB. This dimensional change allows the heatsink to be attached from the opposite side of the board, eliminating the need for surface space and enabling secure attachment in densely packed configurations.
Solution Approach 2:
The solder blades act as an intermediary element between the PCB and the heatsink. Instead of directly attaching the heatsink to the PCB surface using screws or glues, the solder blades extend through the PCB and provide a bonding interface, mediating the connection and eliminating the need for surface-mounted fasteners.
2Reliability
If traditional attachment methods are used, then the heatsink is securely fixed, but the heatsink cannot be easily removed or replaced without affecting other components
Solution Approach 1:
The patent creates a dynamic attachment system where the heatsink can transition between fixed and removable states. The solder blades provide secure fixation during operation, but allow for controlled removal when needed, enabling maintenance and replacement without permanent attachment.
Solution Approach 2:
The attachment system is segmented into separate functional elements: the solder blades remain permanently attached to the PCB, while the heatsink can be independently removed. This segmentation allows the heatsink to be replaced without affecting the PCB or other components, improving maintainability.
3Volume of stationary object
If densely packed components are used to reduce device size, then the device footprint is minimized, but heat dissipation becomes more challenging due to limited space for thermal management
Solution Approach 1:
The patent addresses heat dissipation in compact devices by extending the thermal management solution into the vertical dimension. Solder blades protrude through the PCB, providing thermal contact with the heatsink from the opposite side, enabling effective heat dissipation without increasing the device's horizontal footprint.
Solution Approach 2:
The solder blades serve as a thermal intermediary, conducting heat from the PCB components through the blade structure to the heatsink. This intermediary thermal path enables efficient heat transfer in densely packed configurations where direct contact between components and heatsink would be spatially impractical.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables effective heat dissipation from densely packed components, maintaining operational temperatures within normal ranges and allowing for easy removal and replacement of heatsinks without affecting other components, thus improving the reliability and longevity of LED arrays and other high-power components.
Implementation Method 1
A plurality of solder blades is mounted on a second side of the PCB via surface mount. One or more heatsinks is inserted onto the plurality of solder blades
Implementation Method 2
A plurality of removable clips is used to fasten the one or more heatsinks to the PCB and the plurality of solder blades
Data Source
AI summary
An electronic device includes a printed circuit board (PCB). One or more components mounted on at least one of a first side and a second side of the PCB. The first side and the second side are two opposite sides of the PCB. A plurality of solder blades mounted on the second side of the PCB one or more heatsinks inserted onto the plurality of solder blades mounted on the second side of the PCB.