Solder Bracing Rough Surface for Underfill Delamination Resistance
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Solution Overview
Problem
The manufacturing of semiconductor devices faces challenges due to undesired configurations of semiconductor components, leading to yield loss, poor electrical connections, weak bondability, crack development, and delamination, exacerbated by the differing thermomechanical properties of solder bracing and underfill materials.
Innovation Solution
A semiconductor device with a solder bracing material having a rough surface that increases contact area with the underfill material, enhancing adhesion strength and preventing delamination and crack formation, achieved through chemical treatment or use of a release film to create a staggered, protruded, and recessed surface with controlled roughness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a smooth surface is used for solder bracing material, then the manufacturing process is simple, but the adhesion strength with underfill material is weak leading to delamination
Solution Approach 1:
The patent applies surface curvature by creating a rough surface with protruded and recessed portions on the solder bracing material instead of a smooth flat surface. This curved/irregular surface topology increases the contact area and mechanical interlocking with the underfill material, thereby enhancing adhesion strength and preventing delamination during thermal cycling.
2Reliability
If a rough surface is created on solder bracing material, then adhesion strength with underfill material is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The patent implements preliminary action by forming the rough surface structure on the solder bracing material before applying the underfill material. This pre-created surface topology with protruded and recessed portions ensures optimal adhesion from the beginning, preventing delamination issues that would otherwise require complex post-manufacturing repairs or rework processes.
3Stability of the object's composition
If uniform material properties are used throughout the solder bracing material, then the manufacturing process is simple, but stress distribution is uneven leading to crack formation
Solution Approach 1:
The patent applies local quality by creating regions with different physical properties within the solder bracing material. The rough surface structure introduces local variations in density and composition, with protruded and recessed portions having different material characteristics. This local heterogeneity enables more uniform stress distribution under thermal loading, preventing crack formation while maintaining overall material stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The improved configuration enhances the reliability of the semiconductor device by increasing adhesion strength and preventing delamination and crack formation, resulting in improved performance in pull tests and thermal cycling tests.
Implementation Method 1
A rough surface of the solder bracing material is formed... The rough surface increases a contact area with the underfill material... enhancing adhesion strength
Data Source
AI summary
A method of manufacturing a semiconductor device includes providing a substrate, disposing a plurality of pads on a surface of the substrate, disposing a plurality of conductive bumps on the plurality of pads correspondingly; disposing a solder bracing material surrounding the plurality of conductive bumps and over the surface of the substrate after the disposing of the plurality of conductive bumps, wherein the solder bracing material is in contact with a sidewall of each of the plurality of pads and the plurality of conductive bumps; disposing a release film on the solder bracing material and the plurality of conductive bumps; and removing the release film to form a rough surface of the solder bracing material. The rough surface of the solder bracing material includes a plurality of protruded portions and a plurality of recessed portions.