Solder Bump Inspection Using Pad and Bump Area Detection

The patent extends the image measuring apparatus to perform multiple functions including general geometric measurements and solder defect inspection. By developing algorithms that can detect pad areas, bump areas, and various solder defects (missing bumps, out-of-range bumps, misalignment), the system achieves versatility without requiring separate dedicated inspection equipment for each function.

The inspection algorithm segments the image processing into distinct functional steps: designating inspection areas, detecting pad areas, detecting bump areas, and judging defects. This segmentation allows complex inspection tasks to be broken down into manageable processing stages, making the overall system more manageable and maintainable.

The patent implements feedback mechanisms where the system iteratively refines its defect detection by comparing detected pad and bump areas against predefined criteria. The algorithm continuously adjusts its analysis based on the image data, ensuring accurate identification of solder defects while maintaining high inspection efficiency through automated processing.

The system performs preliminary actions by first designating inspection areas and detecting pad areas before proceeding to bump area detection and defect judgment. This sequential preliminary processing ensures that the foundation for accurate defect detection is established, improving both efficiency and reliability by preparing the data structure in advance.