Non-Uniform Solder Bump Layout for Corner Stress Relief
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Solution Overview
Problem
Semiconductor packages with reduced solder balls are susceptible to mechanical stress concentration at the corner bumps, leading to potential failure due to stress-induced cracks and warpage, especially in compact consumer devices.
Innovation Solution
Implementing non-uniformly sized solder bumps, with larger bumps at the corners and smaller bumps elsewhere, to distribute mechanical stress more evenly and enhance thermal and electrical conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the number of solder balls is reduced to achieve compact packaging, then the device size is reduced, but mechanical stress concentration occurs at corner bumps leading to potential failure
Solution Approach 1:
The patent applies local quality by creating non-uniform solder bump structures where corner bumps are larger and more numerous than center bumps. This local differentiation provides enhanced mechanical support and stress distribution at critical corner locations while maintaining reduced overall package size, thereby resolving the contradiction between compact packaging and mechanical integrity.
Solution Approach 2:
The patent employs asymmetry by designing an unequal distribution of solder bumps across the package substrate, with higher density and larger size at corners compared to the center. This asymmetric configuration optimizes mechanical stress distribution at vulnerable corner regions while enabling reduced total bump count for compact packaging, thus resolving the reliability-size contradiction.
2Ease of manufacture
If uniform solder bumps are used across the substrate, then manufacturing is simplified, but mechanical stress is not evenly distributed causing warpage and cracks
Solution Approach 1:
The patent implements local quality by specifying different solder bump characteristics for different substrate regions: corner areas receive larger, more numerous bumps for stress distribution, while center areas use smaller bumps. This localized differentiation improves stress distribution stability without requiring completely complex manufacturing, balancing ease of manufacture with structural stability.
Solution Approach 2:
The patent applies segmentation by dividing the substrate into distinct regions (corner regions and center regions) with different solder bump specifications. This segmentation allows optimized stress distribution in each region while maintaining manageable manufacturing complexity through clear regional differentiation, resolving the contradiction between manufacturing simplicity and stress distribution stability.
3Strength
If corner bumps are made larger to reduce stress concentration, then mechanical strength is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by specifying enhanced solder bump size at corner locations compared to center locations. This localized size differentiation improves corner mechanical strength where it is most needed, while the manufacturing process maintains control through region-specific parameters rather than requiring extreme precision across all bumps uniformly.
Data Source
AI summary
In some aspects, the disclosure is directed a module for improving mechanical, electrical, or thermal performance. In some embodiments, the module includes a bottom surface, a side surface, a first solder bump disposed on the bottom surface, and a second solder bump disposed on the bottom surface. In some embodiments, the bottom surface extends in a first lateral direction and a second lateral direction perpendicular to the first lateral direction. In some embodiments, the side surface extends in a vertical direction perpendicular to the first lateral direction and the second lateral direction. In some embodiments, the second solder bump is adjacent to the side surface. In some embodiments, the first solder bump has a first length in the first lateral direction. In some embodiments, the second solder bump has a second length in the first lateral direction. In some embodiments, the first length is greater than the second length.