Solder Bump Formation Using Pattern Plate Compression
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Solution Overview
Problem
Current methods for forming solder bumps on semiconductor substrates are complex and environmentally unsafe, involving multiple steps and alignment challenges, which hinder efficient and precise production.
Innovation Solution
A method and apparatus using a solder-loading assembly with compressible plates and a pattern plate with aligned through-holes, where molten solder is filled, chilled, and transferred to a substrate, allowing for simultaneous solidification and excess solder removal, reducing the number of steps and improving alignment efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple steps including alignment plates and procedures are used to apply solder to substrate, then solder application can be achieved, but the process becomes complicated and time-consuming
Solution Approach 1:
The mold plate integrates multiple functions into a single component: it serves as both the alignment reference and the solder application template. The aligned holes in the mold plate simultaneously provide positioning guidance and define solder deposit locations, eliminating the need for separate alignment plates and reducing procedural steps.
Solution Approach 2:
The mold plate is pre-aligned with the substrate before solder application. The holes in the mold plate are预先 positioned to match the target locations on the substrate, so that when solder is applied through the mold plate, accurate placement is achieved without requiring complex real-time alignment procedures.
2Quantity of substance
If conventional solder application methods are used, then solder can be deposited on substrate, but environmental safety is compromised
Solution Approach 1:
The method converts the potentially harmful molten solder into a controlled deposition process. By using the mold plate to guide solder flow and immediately solidifying it through cooling, the process contains the molten material and prevents environmental contamination while achieving precise solder placement.
Solution Approach 2:
The solder undergoes a phase transition from liquid to solid during the deposition process. Molten solder is applied through the mold plate holes and immediately cooled to solidify, creating precise solder deposits without requiring the solder to remain in a harmful molten state, thereby improving environmental safety.
3Reliability
If alignment plates and multiple procedures are used, then solder application can be achieved, but production speed is reduced
Solution Approach 1:
The mold plate combines alignment and solder application functions into a single integrated component and step. The aligned holes provide both positioning guidance and solder deposition paths simultaneously, eliminating multiple sequential operations and significantly improving production speed while maintaining alignment accuracy.
4Ease of operation
If molten solder is applied without immediate solidification, then solder flow is easier, but excess solder removal becomes difficult
Solution Approach 1:
The solder is immediately solidified after application through the mold plate by applying cooling. This phase transition from liquid to solid occurs right at the deposition point, allowing precise control of solder placement and automatic removal of excess solder through the mold plate structure, achieving both ease of operation and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the accurate and efficient deposition of solder bumps on substrates with reduced environmental impact and streamlined manufacturing processes, enhancing production speed and precision.
Implementation Method 1
the pattern plate is chilled through a temperature sufficient to solidify the solder in the through-holes
Implementation Method 2
The wafer substrate and pattern plate may then be heated to a temperature above the melting point of the solder within the through-holes
Data Source
AI summary
An apparatus and a process for the manufacture of a solder-bump adhered wafer substrate for use in the semiconductor industry, comprising one or more of the following steps including: arranging a first compressive member and a second compressive member in an opposed, compressibly displaceable, spaced-apart relationship, with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through-holes arranged thereon; filling the through-holes with a molten solder; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder; chilling the pattern plate to solidify the molten solder in the through-holes; and removing the pattern plate from the spaced-apart compressive members to produce a wafer with solder bumps thereon.