Solder Mass Carrier for PCB Side Edge Plated Openings
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Solution Overview
Problem
The existing methods for connecting electronic components using solder masses are time-consuming and difficult, especially when trying to connect planar contacts on printed circuit boards (PCBs), as they require forming and coupling solder masses to solder-holding elements, and constructing PCBs with overlapping contacts makes electrical connections challenging.
Innovation Solution
A method involving a carrier device to align and deposit a solder mass within a plated opening on the side edge of a PCB, where the solder mass is reflowed to form a secure joint, allowing for electrical conductivity between PCBs with perpendicular bisected plated openings.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder masses are formed and coupled to solder-holding elements before reflow operation, then secure electrical connections can be achieved, but the assembly process becomes very time consuming and difficult
Solution Approach 1:
The solder mass is pre-formed and attached to the component terminal before the reflow operation. This preliminary preparation allows the solder to be in optimal position and condition before heating, ensuring reliable connections while streamlining the overall process by pre-organizing materials rather than forming and positioning them during the reflow cycle itself
2Reliability
If solder masses are formed and coupled to solder-holding elements, then secure electrical connections can be achieved, but the process becomes difficult depending on PCB construction
Solution Approach 1:
The solder mass and holder assembly is designed to be universally applicable to different PCB constructions and component types. The standardized interface and attachment method allow the same basic assembly approach to work across various PCB designs, reducing manufacturing complexity despite variations in specific PCB constructions
3Adaptability or versatility
If PCB contacts are constructed to overlie one another, then electrical connections between planar contacts can be achieved, but it becomes difficult to connect contacts when they overlie partially
Solution Approach 1:
Instead of attempting to connect overlapping planar contacts in the same plane, the invention uses a solder mass that extends vertically between the contacts. The solder is heated and flows downward to connect the upper and lower contacts, effectively moving the connection process from a two-dimensional planar problem to a three-dimensional vertical solution, making overlapping contact connections feasible
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables rapid and accurate assembly of electronic components by securely holding solder within plated openings, facilitating electrical connections between PCBs that were previously impossible with conventional soldering techniques, enhancing the efficiency of surface mount technology attachments.
Implementation Method 1
reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening
Data Source
AI summary
A method and device for depositing a solder mass within a plated opening that is formed in a side edge of an electronic device includes the steps of carrying the solder mass in a carrier device and orienting the carrier device with respect to the side edge such that the solder mass is aligned with the plated opening. The method further includes reflowing the solder mass to cause the solder mass to be deposited and securely held within the plated opening and then removing the carrier device leaving the solder mass behind within the plated opening and along the side edge of the electronic device.