Solder-Coated Electronic Component for Screwless Resin Encapsulation
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Solution Overview
Problem
Conventional electronic components with substrates fixed using screws face challenges in downsizing due to the need for multiple screw fixings and additional space requirements, and accommodating the substrate in a housing complicates miniaturization.
Innovation Solution
An electronic component design featuring a substrate bonded with solder, a coating to isolate the solder from a thermoplastic resin covering, and a covering portion made of thermoplastic resin with a melting point higher than the solder, allowing for integral molding without screw fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the substrate is fixed with screws to the housing, then the substrate is securely fixed, but the electronic component size increases due to space required for screws and fixing portions
Solution Approach 1:
The substrate and housing are merged into a single integrated structure formed by injection molding. The substrate is directly molded as part of the housing body, eliminating the need for separate screw fixing mechanisms. This integration maintains structural strength while significantly reducing the overall component size by removing dedicated fixing portions and screw spaces.
Solution Approach 2:
The mechanical screw fixing system is replaced with a thermal molding process. The substrate is bonded to the housing through injection molding, where molten resin directly bonds to the substrate surface. This substitution eliminates mechanical fasteners and their associated space requirements while maintaining secure attachment.
2Reliability
If the substrate is accommodated in a separate housing, then the substrate is protected, but the housing size increases to accommodate the substrate
Solution Approach 1:
The housing and substrate are combined into a single integrated component. The substrate is not placed inside a separate housing but is instead formed as an integral part of the housing structure through injection molding. This eliminates the need for additional housing volume to accommodate the substrate while maintaining protection through the integrated design.
Solution Approach 2:
The substrate is nested within the housing structure during the injection molding process. The molten resin flows around and bonds to the substrate, embedding it within the housing material. This nesting approach protects the substrate while minimizing overall housing volume since the substrate becomes part of the housing structure rather than occupying separate space within it.
3Strength
If multiple screws are used to fix the substrate, then the fixing is secure, but the manufacturing complexity and number of components increase
Solution Approach 1:
Multiple separate components (substrate, housing, screws, fixing portions) are merged into a single integrated component formed by injection molding. The substrate and housing become one piece, eliminating the need for multiple discrete parts and assembly steps while maintaining secure attachment through the molded bond.
Solution Approach 2:
The injection molding process itself provides the fixing function. The molten resin automatically bonds to the substrate during molding, creating a self-contained structure that requires no additional fixing operations. The manufacturing process serves its own purpose of both forming the housing and securing the substrate simultaneously.
4Reliability
If a cover is added to protect the exposed substrate, then the substrate is protected from failure, but the component size and structure become more complex
Solution Approach 1:
The cover and housing are merged into a single integrated structure. The injection molded housing simultaneously forms both the protective enclosure and the substrate mounting structure. This eliminates the need for separate covers while maintaining protection, as the housing itself becomes the protective element that encloses and secures the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables the electronic component to be downsized without the need for screw fixings, reduces the number of components and manufacturing steps, and protects the substrate without a housing structure.
Implementation Method 1
a covering portion that covers the substrate and the coating and is made of a thermoplastic resin having a melting point higher than a melting point of the solder
Implementation Method 2
a covering portion that covers the substrate and the coating and is made of a thermoplastic resin having a melting point higher than a melting point of the solder
Implementation Method 3
a coating that covers the solder
Data Source
AI summary
An electronic component includes: a substrate to which a component is bonded by solder; a coating that covers the solder; and a covering portion that covers the substrate and the coating and is made of a thermoplastic resin having a melting point higher than a melting point of the solder.