Variable-Height Solder Contact Pins Without Interface Mismatch
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Solution Overview
Problem
Existing methods for forming solder contact pins on substrates are limited in generating soldering points of varying sizes, particularly heights, required for specific bonding applications, and often require the use of different materials that can lead to interface problems.
Innovation Solution
A method and apparatus for forming solder contact pins by arranging and melting solder balls on a substrate using a transporting tool with ultrasound-assisted distribution, negative pressure, and laser melting to create variable-height solder bumps and pillars without the need for conductive adhesives or additional soldering materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional methods using masks and vibration are used to place solder contact pins, then solder contact pins of specific sizes can be placed on the substrate, but different materials for substrate, contact medium and contact pin material lead to interface problems
Solution Approach 1:
The patent uses solder balls made of the same material as the contact pins, eliminating material interfaces. The solder balls are melted to form contact pins directly on the substrate, ensuring homogeneous material composition throughout the connection structure, thereby avoiding interface problems between different materials.
Solution Approach 2:
The patent combines the functions of placing and forming contact pins into a single process. By melting solder balls that are already placed on the substrate, the method merges the placement and formation steps, eliminating the need for separate contact pin components and reducing material interfaces.
2Manufacturing precision
If solder contact pins of certain sizes are used for specific applications, then the required connection can be achieved, but solder contact pins of different sizes as well as a holder and a mask of the corresponding size must be used
Solution Approach 1:
The patent changes the physical state of solder balls from solid to liquid through melting, allowing them to be formed into contact pins of various sizes. By controlling the melting process and the amount of solder material, different contact pin dimensions can be achieved without requiring different-sized holders and masks for each application.
Solution Approach 2:
The patent creates a universal solder ball placement system that can produce contact pins of different sizes using the same basic apparatus. The solder balls serve multiple functions: they are placed, melted, and formed into contact pins of varying dimensions, eliminating the need for multiple specialized holders and masks.
3Strength
If another substrate is to be connected to the solder contact pins, then connection can be established, but electrically conductive adhesives or soldering material with a lower melting point must be used
Solution Approach 1:
The patent uses solder material that is homogeneous with the contact pins, eliminating the need for separate adhesives or lower melting point materials. The same solder material serves both as the contact pin and as the connection medium, ensuring consistent material properties and eliminating temperature mismatches.
4Reliability
If conventional soldering methods are used, then solder contact pins can be attached to the substrate, but the process requires multiple steps including placement, alignment, and separate soldering
Solution Approach 1:
The patent merges the placement and soldering steps into a single process. Solder balls are placed on the substrate and then melted in situ to form the contact pins, combining what were previously separate operations into one integrated process, thereby improving productivity without compromising attachment reliability.
Solution Approach 2:
The patent performs preliminary placement of solder balls before melting them. The solder balls are positioned in advance at the correct locations, and then the melting process transforms them into the final contact pin form, separating the placement preparation from the formation step while maintaining process efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the quick and efficient formation of solder contact pins with variable heights, reducing interface problems by using solely soldering material, and ensuring stable attachment of electronic components without material mismatches.
Implementation Method 1
a negative pressure produced in a cavity of the solder ball fixing device for sucking and fixing the solder balls to the passages
Implementation Method 2
The solder balls placed on the substrate are melted to the substrate by applying laser energy onto them
Implementation Method 3
melting the plurality of first solder balls and releasing the plurality of first solder balls from the transporting tool to the plurality of contact pads so as to form a plurality of solder bumps
Implementation Method 4
A method and apparatus for forming solder contact pins by arranging and melting solder balls on a substrate using a transporting tool with ultrasound-assisted distribution
Data Source
AI summary
A method of forming a plurality of solder contact pins on a contact pad layout of a substrate including the steps of arranging a plurality of first solder balls at an arranging layout of a transporting tool, the arranging layout of the transporting tool corresponding to the contact pad layout of the substrate, placing the transporting tool opposite the substrate such that the plurality of first solder balls is associated with the plurality of contact pads, melting the plurality of first solder balls and releasing the plurality of first solder balls to the plurality of contact pads so as to form a plurality of solder bumps arranging a plurality of second solder balls at the arranging positions and releasing the plurality of second solder balls from the transporting tool so as to form a plurality of monolithic solder contact pins on the plurality of contact pads.