PCB Mounting Inspection Using Solder Coordinate Verification

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Solution Overview

Problem

The existing component mounting process lacks a precise method to verify the reliability of the component mounting apparatus, particularly in ensuring accurate positioning and alignment of electronic components on printed circuit boards during the soldering and reflow processes.

Innovation Solution

A component mounting system that integrates data interlocking between inspection apparatuses, using solder inspection, first mounting inspection, and second mounting inspection apparatuses to generate and verify coordinate correction data, ensuring accurate positioning and monitoring the operation of the component mounting apparatus through coordinate correction data and measurement data analysis.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If coordinate correction data is generated and transmitted from solder inspection apparatus to component mounting apparatus, then positioning accuracy of components is improved, but there is no verification method to ensure the component mounting apparatus properly applies the coordinate correction data

Engineering Contradiction:
Improvepositioning accuracy of componentsVSAvoidverification reliability of mounting process
Core Design Contradiction:
Manufacturing precisionVSReliability

Solution Approach 1:

The patent implements a feedback mechanism where measurement data from mounting inspection apparatus is transmitted back to verify whether coordinate correction data was properly applied. The system compares the actual mounting positions with the expected positions based on coordinate correction data, creating a closed-loop verification system that ensures reliability of the positioning process.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The patent introduces measurement data as an intermediary element that mediates between the coordinate correction data and the final mounting result. By measuring and analyzing the actual mounting positions, the system creates a verifiable link between the coordinate correction application and the positioning outcome, enabling indirect verification of the mounting process.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If multiple inspection apparatuses are used in the component mounting process, then measurement precision is improved, but device complexity increases

Engineering Contradiction:
Improvemounting state inspection precisionVSAvoidinspection system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent makes the mounting inspection apparatus multi-functional by enabling it to perform both inspection functions (measuring mounting state) and verification functions (checking coordinate correction application). This allows a single apparatus to serve multiple purposes in the process, reducing the need for separate dedicated devices for each function while maintaining measurement precision.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent combines the inspection and verification functions into an integrated data analysis system. By merging the measurement data collection with the coordinate correction verification in a unified process, the system reduces operational complexity and streamlines the workflow while maintaining the benefits of multiple measurement points.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentEP3223594B1Component inspection apparatus and component mounting system having same
Publication Date: 2021.03.24 KOHYOUNG TECH
  • EP3223594B1 patent drawingFigure 1~2
  • EP3223594B1 patent drawingFigure 3
  • EP3223594B1 patent drawingFigure 4

AI summary

A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.