Continuous Solder-Core Connectors for Semiconductor Structural Integrity
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Solution Overview
Problem
The miniaturization of semiconductor devices leads to structural integrity issues such as delamination and cracking due to stress, temperature fluctuations, and mismatched coefficients of thermal expansion (CTE) in materials, particularly affecting low dielectric (LK) structures.
Innovation Solution
The implementation of continuous solder-core connectors with a peripheral wall and inner-core configuration, which reduces internal stress by eliminating intervening metallic structures and improving stress integration, thereby minimizing the likelihood of delamination and cracks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If circuit size is decreased to achieve higher density and faster devices, then productivity and device performance are improved, but structural integrity deteriorates leading to delamination and cracking
Solution Approach 1:
The patent changes the material parameter by using a continuous solder core with uniform composition instead of traditional multi-layer metallic structures. This continuous core has matched CTE properties that reduce thermal stress during temperature fluctuations, thereby preventing delamination and cracking while maintaining high device density
Solution Approach 2:
The patent employs a composite structure consisting of a continuous solder core surrounded by a peripheral wall. The solder core material is specifically selected to have CTE matched to the semiconductor device, creating a composite connector that provides both mechanical support and thermal expansion compatibility, thus improving structural integrity at miniaturized dimensions
2Reliability
If continuous solder-core connectors are implemented to improve structural integrity, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent segments the connector into two functional parts: a continuous solder core for stress absorption and CTE matching, and a peripheral wall for structural support and alignment. This segmentation allows each part to perform its specific function optimally while together they provide a complete connector solution that improves reliability without excessive complexity
Solution Approach 2:
The patent extracts the problematic intervening metallic structures from the connector design and replaces them with a continuous solder core. By removing the multi-layer metallic composition that caused CTE mismatch and stress concentration, the design simplifies the connector structure while actually improving structural integrity through the homogeneous solder material
Data Source
AI summary
Semiconductor devices including continuous-core connectors and associated systems and methods are disclosed herein. The continuous-core connectors each include a peripheral wall that surrounds an inner-core configured to provide an electrical path using uniform material.