Solder Tape Cutting Layout for Compact Parallel Mounting Lines

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Solution Overview

Problem

Conventional solder cutting devices require a significant installation area due to the orthogonal orientation of their components, leading to increased device width and inefficient use of space in production systems.

Innovation Solution

The design reorients the drive shafts and drive parts of the solder cutting device to align with the direction of the tape-like solder material, reducing the device's width and allowing for more compact installation by integrating the guidance member and suppression unit to efficiently manage the tape-like solder material.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the drive shafts and drive parts are oriented orthogonally to the tape-like solder material (width direction), then the components can be arranged on one side of the output shafts, but the device width increases significantly, requiring larger installation area

Engineering Contradiction:
Improvecomponent arrangementVSAvoiddevice width
Core Design Contradiction:
Ease of operationVSArea of stationary object

Solution Approach 1:

The patent changes the orientation of drive shafts from the width direction (orthogonal to tape movement) to the length direction (parallel to tape movement). This dimensional reorientation allows drive parts to be arranged above and below the tape path rather than side-by-side, effectively utilizing the vertical dimension to reduce the horizontal footprint of the device.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Instead of arranging drive components on one side of the output shafts in the conventional manner, the patent inverts this arrangement by positioning drive shafts parallel to the tape movement direction, with drive parts distributed above and below the tape path. This inverted configuration reduces the device width while maintaining functional requirements.

Inventive Principle:
Principle #13The other way round (Inversion)

2Productivity

If multiple solder cutting devices are installed in parallel in the width direction, then production capacity increases, but the installation area in the factory is increased

Engineering Contradiction:
Improveproduction capacityVSAvoidinstallation area
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

By reorienting drive shafts to run parallel to the tape movement direction, the patent enables multiple devices to be arranged more compactly in the width direction. The reduced device width allows parallel installation of multiple solder cutting devices within the same factory floor space, increasing production capacity without proportionally increasing installation area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Area of stationary object

If the device width is reduced by reorienting drive shafts, then space utilization improves, but the complexity of integrating guidance member and suppression unit increases

Engineering Contradiction:
Improvedevice widthVSAvoidintegration complexity
Core Design Contradiction:
Area of stationary objectVSDevice complexity

Solution Approach 1:

The patent integrates the guidance member and suppression unit into a unified configuration that works together with the reoriented drive shafts. The guidance member guides the tape-like solder material while the suppression unit manages material flow, and both are positioned to cooperate with the parallel-oriented drive shafts, creating a compact integrated assembly that reduces overall device width.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The guidance member and suppression unit are designed to perform multiple functions within the compact configuration. The guidance member not only directs the tape but also works with the suppression unit to control material flow and positioning, reducing the need for separate components and simplifying the overall integration despite the reduced space.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentEP4101573B1Solder cutting device, solder cutting unit, part mounting device, and production system
Publication Date: 2024.07.17 HIRATA CORPORATION
  • EP4101573B1 patent drawingFigure 1
  • EP4101573B1 patent drawingFigure 2(A)~2(C)
  • EP4101573B1 patent drawingFigure 3(A)~3(D)

AI summary

A solder cutting device (3) comprises a first holding part (31), a first drive part (32) that feeds a tape-like solder material (21), which is held by the first holding part (31) in a first direction, a cutting part (33) for cutting the tape-like solder material (21), and a second drive part (34) that actuates the cutting part, wherein the first drive part (32) is a first actuator of an electric drive that converts the rotational motion of a rotating body, the axis of which extends in the first direction, to a motion in the first direction, and the second drive part (34) comprises a second actuator that moves a moving body (343) in the first direction, and a connection part (383) that converts the motion of the moving body (343) to a motion in a second direction and transmits the motion to the cutting part (33).