Solder Paste Inspection Defect Mapping for Accurate PCB Repair

The patent replaces manual visual inspection with an automated image processing system that captures soldering point images, processes them through algorithms to identify defective areas, and generates repair guidance. This substitution of mechanical/manual inspection with an automated optical-electronic system resolves the contradiction by maintaining high inspection accuracy while dramatically improving production efficiency and reducing labor costs.

The system enables self-service by automatically generating repair guidance information that directs operators to specific defective areas with precise location and extent data. The automated image processing and analysis perform the inspection work that would otherwise require manual labor, reducing labor costs while maintaining repair capability through the generated guidance information.

The patent merges the immediate detection function with subsequent inspection and repair guidance functions into a single integrated system. The same image processing system that performs immediate solder paste detection also processes defective soldering point images and generates repair guidance, eliminating the need for separate manual inspection steps and improving operational convenience while maintaining quality control.