Solder Joint Disconnection Apparatus with Segmented Laser and Suction Modules
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Solution Overview
Problem
Existing apparatuses for disconnecting solder joints in disk drive units are inefficient due to unstable laser energy, inadequate suction force, and cumbersome maintenance, leading to prolonged maintenance times and reduced work efficiency.
Innovation Solution
A separate laser device and solder material removal device with a nozzle and holder system, featuring a glass cover with a hole for airflow and multiple pumping devices for enhanced suction, allowing for precise adjustment of the optical axis and easy cleaning and replacement of components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the laser device and solder material removal device are integrated in a single handling device, then the structure is compact, but the optical axis adjustment becomes difficult and laser energy stability decreases
Solution Approach 1:
The patent divides the integrated handling device into separate functional modules: the laser device (210) is separated from the solder material removal device (nozzle device 310 and holder 320). This segmentation allows independent optimization of each module, enabling precise optical axis adjustment of the laser device while maintaining stable laser energy delivery to the solder joint.
2Device complexity
If the lens is positioned at the top of the handling device, then the structure is simplified, but solder material accumulates on the lens reducing laser efficiency
Solution Approach 1:
The patent extracts the lens (212) from the handling device structure and positions it within the laser device (210) assembly. This extraction prevents solder material from accumulating on the lens surface, as the lens is no longer exposed to the solder removal zone. The laser beams can thus maintain stable energy transmission without being blocked or scattered by solder residue.
3Device complexity
If a single pumping device is used, then the device is simpler, but the suction force is insufficient causing solder material blockage
Solution Approach 1:
The patent employs multiple pumping devices (330) instead of a single pumping device. These multiple pumps work in parallel to provide enhanced suction force through the second passage (321) and first passage (311) of the holder. This increased suction capability ensures complete removal of melted solder material from the solder joint area, preventing blockages and maintaining continuous operation.
4Ease of manufacture
If the handling device has a unitary structure, then manufacturing is easier, but cleaning and maintenance become cumbersome and time-consuming
Solution Approach 1:
The patent designs the holder (320) and nozzle device (310) as separable components rather than a unitary structure. The nozzle device can be detached from the holder for easy cleaning and maintenance. This segmentation allows quick removal and cleaning of the nozzle device without disassembling the entire holder structure, significantly reducing maintenance time and effort while maintaining manufacturing simplicity through modular design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design stabilizes laser energy, reduces maintenance workload, and improves efficiency by preventing solder residue accumulation and allowing for precise adjustments, thus shortening maintenance time and enhancing the apparatus's overall performance.
Implementation Method 1
a laser device for emitting laser beams to a solder joint, thereby melting the solder joint into melted solder material
Implementation Method 2
at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder
Data Source
AI summary
An apparatus for disconnecting solder joints between two welded surfaces includes a laser device for emitting laser beams to a solder joint, and a solder material removal device. And the solder material removal device includes a nozzle device having a first passage, a holder holding the nozzle device and having a second passage communicated with the first passage, and at least two pumping devices connected to the holder to pump the melted solder material out from the nozzle device and the holder. The laser device and the solder material removal device are separated, a glass cover with a hole formed thereon is covered on the top of the holder, and the laser device is located above the glass cover and separated from the holder. The present invention can shorten maintenance time and maintenance workload and improve work efficiency, furthermore reduce and stabilize the laser energy.