Solder Feeder with Squeegee Detection for Cycle Loss Prevention
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Solution Overview
Problem
Existing solder printing technologies face challenges in accurately measuring and replenishing solder residue without causing cycle loss or limiting substrate size, due to issues with solder dripping and inefficient operation sequences.
Innovation Solution
A solder feeder system with a printer that uses a single squeegee for forward and backward print processes, equipped with solder amount measuring means, replenishment necessity determination means, and replenishment control means, allowing for precise measurement and replenishment of solder without cycle loss, even on substrates with varying mask sizes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If solder detection and replenishment are performed after positioning the substrate to avoid solder dripping, then solder printing accuracy is improved, but production cycle time increases due to delayed start of subsequent printing
Solution Approach 1:
The patent performs solder detection and replenishment before substrate positioning and printing operations. The solder pool is detected by a sensor, and if the solder amount is insufficient, replenishment is performed in advance. This preliminary action ensures that solder printing accuracy is maintained while avoiding delays in the production cycle, as the detection and replenishment occur during the positioning phase rather than after it.
2Measurement precision
If the squeegee moves toward the opening part of the mask during backward movement, then the sensor can detect solder residue, but solder drips from the squeegee and adheres to the substrate through the opening part causing positioning errors
Solution Approach 1:
The patent introduces a non-opening part of the mask as an intermediary detection area. The sensor detects solder residue on the non-opening part of the mask, which is adjacent to but separate from the opening part. This intermediary area allows for accurate solder detection without the risk of solder dripping onto the substrate through the opening, thus maintaining both detection accuracy and substrate positioning accuracy.
3Reliability
If the squeegee is moved a constant distance in the returning direction to move the solder pool toward a non-opening part, then solder dripping is avoided, but a region in the mask must be reserved for overrun which narrows the region for opening parts and limits substrate size
Solution Approach 1:
The patent replaces the mechanical approach of moving the squeegee a constant distance with a control-based approach. The sensor detects the actual solder pool position and amount, and the squeegee movement is controlled based on this feedback information. This substitution allows for reliable solder printing without requiring reserved overrun regions, thereby maintaining adaptability to various substrate sizes.
4Adaptability or versatility
If a pair of squeegees with different directions of tilt are used alternately for pressing the solder pool, then solder can be applied in both forward and backward directions, but the moving range must accommodate sensor positioning which complicates the operation sequence
Solution Approach 1:
The patent uses a single squeegee that performs multiple functions: it presses the solder pool during forward movement, detects solder residue during backward movement (when the sensor is positioned near the squeegee), and enables both forward and backward printing operations. This multi-functional approach eliminates the need for a pair of squeegees and simplifies the operation sequence while maintaining printing direction flexibility.
Data Source
AI summary
Disclosed is a print technology in which a solder pool staying on the surface of a mask is driven by means of a squeegee, and solder is applied onto a substrate onto which the lower surface of a mask is placed. A forward print process where solder is applied by driving a squeegee in a predetermined forward direction relative to a mask, and a backward print process where the solder is applied by driving the squeegee in a returning direction opposite to the forward direction are switched alternately. When the squeegee passes through the solder pool on the downstream side in a moving direction before switching in the course of switching from any one of the forward and backward print processes to the other one of these processes, the amount of solder in the solder pool is measured. Based on the amount of solder thus measured, the necessity of replenishing solder is determined. The solder pool is supplemented with solder, based on the result of the decision on whether solder replenishment is required.