Water-Soluble Solder Flux Composition to Prevent Ball Missing
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Solution Overview
Problem
Water-soluble fluxes used in soldering often result in solder ball deviation from the joint during reflow and flux residue washing, leading to ball missing issues.
Innovation Solution
A flux composition containing 1,2,3-propanetricarboxylic acid, a water-soluble base agent, and a solvent, without water, with specific ratios of these components to enhance solder wettability and prevent ball missing, including nonionic and weak cationic surfactants and rosin for improved performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a water-soluble flux is used to enhance ease of washing, then flux residue can be easily removed with water, but solder ball deviation and ball missing occur during reflow and washing
Solution Approach 1:
The patent changes the chemical parameters of the flux by specifying precise compositional ranges: organic acid content at 0.1-10% by mass, water-soluble base agent at 5-50% by mass, and solvent at 80-45% by mass. These parameter adjustments optimize the balance between washability and solder joint stability, preventing ball missing while maintaining ease of cleaning.
Solution Approach 2:
The flux employs a composite formulation combining multiple functional components: organic acids (for activation and cleaning), water-soluble base agents (for neutralization and washability), and solvents (for viscosity control and application). This composite structure enables simultaneous achievement of easy washing and reliable solder joint formation without ball deviation.
2Strength
If flux composition is optimized for solder wettability, then strong joining is achieved, but ball missing occurs after reflow and washing
Solution Approach 1:
The patent optimizes the concentration parameters of flux components to achieve the desired balance. Specifically, the organic acid content is controlled at 0.1-10% by mass to ensure adequate activation for strong joining while the water-soluble base agent at 5-50% by mass provides neutralization capacity to prevent excessive residue that could cause ball missing during washing operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The flux composition significantly enhances solder wettability and suppresses ball missing after reflow and flux residue washing, ensuring reliable solder joint formation.
Implementation Method 1
fluxes used for soldering have efficacy of chemically removing a metal oxide present between a solder and the metallic surface of an object to be joined
Implementation Method 2
water-soluble flux capable of easily washing a residue with water
Implementation Method 3
soldering using the flux allows the formation of an intermetallic compound between the solder and the metallic surface of the object to be joined
Data Source
AI summary
A flux containing an organic acid, a water-soluble base agent, and a solvent, but not containing water is adopted. In this flux, the organic acid includes 1,2,3-propanetricarboxylic acid. The water-soluble base agent is one or more selected from the group consisting of a nonionic surfactant and a weak cationic surfactant. The content of the 1,2,3-propanetricarboxylic acid is 1% by mass or more and 15% by mass or less with respect to the total amount of the entire flux, the total content of the water-soluble base agent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux, and the total content of the solvent is 30% by mass or more and 65% by mass or less with respect to the total amount of the entire flux. According to this flux, the wettability of solder can be enhanced and ball missing after reflow and flux residue washing is suppressed.