Solder Flux Viscosity Control for Residue Removal
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Solution Overview
Problem
Current methods for removing solder flux residue after heating processes are challenging due to increased viscosity, making it difficult to access low clearance spaces and are often hazardous or costly, especially with the ban on chlorofluorocarbons and other halide chemicals.
Innovation Solution
Materials with increased mobility after heating are developed by forming temporary association forces, such as acid-base interactions, which increase viscosity before heating, and then decrease as volatile or decomposable ingredients evaporate or decompose, reducing viscosity and apparent molecular weight, facilitating easier residue removal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder flux is heated in a reflow process, then a solder joint is formed, but the solder flux residue viscosity increases making it difficult to remove
Solution Approach 1:
The patent applies parameter changes by modifying the chemical composition parameters of the solder flux to control viscosity behavior. The flux is formulated with specific ingredients that maintain high viscosity at room temperature for good solder joint formation, then undergo controlled chemical changes during heating to reduce residue viscosity for easy removal.
Solution Approach 2:
The patent implements periodic action through a two-stage process: first, the flux performs its primary function of holding the flip chip and forming solder joints during heating; second, after cooling, the flux residue automatically transforms into a low-viscosity state that allows easy removal by water or cleaning agents.
2Ease of operation
If special defluxing agents are used to remove solder flux residue, then residue removal effectiveness improves, but fire hazard increases
Solution Approach 1:
The patent converts the potential harm of flammable defluxing agents into a benefit by formulating the solder flux itself to be water-soluble and non-flammable. The flux contains ingredients that naturally break down into water-soluble components after heating, eliminating the need for hazardous defluxing agents entirely.
3Ease of operation
If special cleaning instruments are used to remove solder flux residue, then residue removal effectiveness improves, but cost increases
Solution Approach 1:
The patent implements self-service by designing the solder flux to automatically transform into an easily removable state after heating. The flux residue becomes water-soluble without requiring any special cleaning instruments or complex processes, allowing standard water or mild cleaning agents to effectively remove residues.
4Reliability
If multiple cleaning steps are used to remove solder flux residue, then residue removal completeness improves, but process time increases
Solution Approach 1:
The patent applies preliminary action by incorporating viscosity-reducing ingredients into the solder flux formulation before application. These ingredients are designed to activate during the heating process, pre-transforming the flux residue into a water-soluble, low-viscosity state that can be completely removed in a single quick cleaning step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The materials exhibit reduced viscosity and increased mobility post-heating, simplifying the cleaning process and reducing the difficulty in removing residues from complex spaces without the need for hazardous or costly cleaning agents.
Implementation Method 1
at least one of the at least two ingredients has a lower boiling point than another of the at least two ingredients, wherein the at least one ingredient having the lower boiling point is substantially evaporated from the material after heating the material
Implementation Method 2
at least one of the at least two ingredients has a lower decomposition temperature than another of the at least two ingredients, wherein the at least one ingredient having the lower decomposition temperature substantially decomposes in the material after heating the material
Implementation Method 3
as a result of heating in the reflow process, the solder flux residue typically has a viscosity that is much higher than that of the original solder flux due to evaporation of volatile components
Data Source
AI summary
Materials having increased mobility after heating are disclosed. In one particular exemplary embodiment, the materials may be realized as a material which has reduced apparent molecular weight and/or viscosity and thus increased mobility after a heating process, and which consequently allows material residue to be more easily removed during subsequent cleaning processes. Such a material may be useful in any industrial process which requires heating the material followed by removing material residue.